First author bold, Corresponding author “*”
2023
Lyu, Shuhang, Qianying Wu, and Tiwei Wei. “Hotspot-targeted Cooling Scheme with Hybrid Jet Impingement/Thermal Through Silicon Via (TSV).” 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2023.
Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, Kenneth Goodson (2022). Point-Contact Bonding of Integrated 3D Manifold Microchannel Cooling Within Direct Bonded Copper (DBC) Platform. Journal of Electronic Packaging, 1-20.
Hong Yang, Michael Armstrong, Harry Radousky, Ryan Austin, Zheng Gong, Tiwei Wei, Wendy Mao, Alexander Goncharov, Arianna Gleason.Yang H, Armstrong M, Radousky H, et al. Ultrafast observation of temperature in laser-shocked Al and Zr[J]. Bulletin of the American Physical Society, 2023.
Lin, Yujui*, Tiwei Wei*, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, and Kenneth Goodson. “Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module.” Journal of Electronic Packaging (2023): 1-45.
H Oprins, Tiwei Wei, Vladimir Cherman, E Beyne (2023, May). Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD–FEM modeling study. In 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1-10). IEEE.
Hao Chen, Yujui Lin, Tiwei Wei, Xiaoling Li, Riya Paul, Reece Whitt, Xiaoqing Song, Yue Zhao, Mehdi Asheghi, H Alan Mantooth (2023, March). Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler. In 2023 IEEE Applied Power Electronics Conference and Exposition (APEC) (pp. 366-371). IEEE.
Lin, Y., Wei, T. W., Asheghi, M., Goodson, K. E.*, The Capillary-driven Two-phase Embedded Microchannel Heatsink for the Efficient Cooling of Power Electronic Modules, Bulletin of the American Physical Society, 2023
2022
Wei, T. W., Lin, Z., Asheghi, M., & Goodson, K. E*., Micro-channel Cooling Technique to Minimize Thermal Deformation of the X-ray and High-power Laser Optics, International Conference on Synchrotron Radiation Instrumentation (SRI) 2022.
Wei, T. W.*, Hazra, S., Asheghi, M., & Goodson, K. E. Numerical Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3D Manifold Coolers. Journal of Electronic Packaging 2022. DOI: 10.1115/1.4055468 [PDF]
Chen H, Wei, T. W., et al. Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler[C]//2022 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE, 2022: 962-965. DOI: 10.1109/APEC43599.2022.9773698 [PDF]
Wei, T. W., Chen H., Lin Y., Hazra S., Chen Y., G. Prakash, N. Li, Y. Lu, H. A. Mantooth, Asheghi, M., Goodson K. E., “Demonstration and Experimental Characterization of DBC Active Laser-cut Microchannel Cooling with 3D Manifold,” 21th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2022.
Wei, T. W., Lin, Z., Asheghi, M., & Goodson, K. E*., “Micro-channel Cooling Technique to Minimize Thermal Deformation of the X-ray and High-power Laser Optics”, International Conference on Synchrotron Radiation Instrumentation (SRI) 2022.
H. Chen, Wei, T. W., Y. Chen, X. Li, N. Li, Q. Zhu, S. Hazra, Y. Zhao, M. P. Gupta, M. Asheghi, Y. Lu, K. Goodson, H. A. Mantooth, “Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler” 2022 IEEE Applied Power Electronics Conference and Exposition. [PDF]
Wei, T. W., Zhang, L., Asheghi, M., Goodson, K. E.*, Embedded Micro-channel Cooling Technique to Minimize Thermal Deformation of X-ray and High-power Laser Optics, Journal of Physics: Conference Series, 2022, 2380 (1), 012071[PDF]
Chen, H., Wei, T. W., Li, X., Chen, Y., Lin, Y., Chinnaiyan, S., Asheghi, M., Mantooth, H. A., Demonstration of Wire bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler, 2022 IEEE Energy Conversion Congress and Exposition [PDF]
Hazra, S.*, Wei, T. W., Lin, Y., Asheghi, M, Goodson, K., Gupta M. P., Degner M., Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling, International Journal of Heat and Mass Transfer, 2022, 197, 123356. [PDF]
2021
Wei, T. W.*, Oprins, H., et al., Heat Transfer and Friction Factor Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets, Int. J. Heat Mass Transf, 2021, Volume 182, 121865. DOI: 10.1016/j.ijheatmasstransfer.2021.121865 [PDF]
2020
Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, T., Nozzle Scaling Effects for the Thermohydraulic Performance of Microjet Impingement Cooling with Distributed Returns, Applied Thermal Engineering, Volume 180, 5 November 2020, 115767. DOI: 10.1016/j.applthermaleng.2020.115767 [PDF]
Wei, T. W.*, All-in-one design integrates microfluidic cooling into electronic chips, Nature, News and Views, 585, 188-189. (2020) (Invited) DOI: 10.1038/d41586-020-02503-1 [PDF]
Wei, T. W.*, Oprins, H., et al., Experimental and Numerical Study of 3D Printed Direct Jet Impingement Cooling for High Power, Large Die Size Applications, in IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020. DOI: 10.1109/TCPMT.2020.3045113 [PDF]
Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2020). Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5 D integrated systems. Applied Thermal Engineering, 2020, 164, 114535. DOI: 10.1016/j.applthermaleng.2019.114535 [PDF]
Wei, T. W., Jung, K. W., Piazza, A., Hazra, S., Iyengar, M., Malone, C., Asheghi, M., & Goodson, K. E*. Parametric CFD Study of Large Footprint (24 x 24 mm2) Silicon-based Embedded Microchannel-3D Manifold Coolers. InterPACK 2020. (presentation only)
Wei, T. W.*, Oprins, H., Cherman, V., Yang, Z., Rivera, K., Van der Plas, G., Pawlak, B. J., England, L., Beyne, E., & Baelmans, M., “Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications”, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 1422-1429. [PDF]
2019
Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels. Fluids, 4(3), 145. DOI: 10.3390/fluids4030145 [PDF]
Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Low-cost Energy Efficient On-chip Hotspot Targeted Microjet Cooling for High Power Electronics. IEEE Transactions on Components, Packaging and Manufacturing Technology. vol. 10, no. 4, pp. 577-589, April 2020. DOI: 10.1109/TCPMT.2019.2948522 [PDF]
Wei, T. W.*, Oprins, H., Cherman, V., Van der Plas, G., De Wolf, I., Beyne, E., & Baelmans, M. (2019). Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip. Applied thermal engineering, 152, 308-318. DOI: 10.1016/j.applthermaleng.2019.02.075 [PDF]
Wei, T. W.*, Oprins, H., Cherman, V., Yang, S., De Wolf, I., Beyne, E., & Baelmans, M. (2019). Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(9), 1815-1824. DOI: 10.1109/TCPMT.2019.2905610 [PDF]
Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Van der Plas, G., Beyne, E., & Baelmans, M. (2019, May). Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5 D Si Interposer Packages. In 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1243-1252). IEEE. [PDF]
Wei, T. W.*, Oprins, H., Beyne, E., & Baelmans, M. (2019, May). First Demonstration of a Low Cost/Customizable Chip Level 3D Printed Microjet Hotspot-Targeted Cooler for High Power Applications. In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (pp. 126-134). IEEE. [PDF]
2018
Wei, T. W.*, Oprins, H., Cherman, V., Qian, J., De Wolf, I., Beyne, E., & Baelmans, M. (2018). High-Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices. IEEE Transactions on Power Electronics, 34(7), 6601-6612. DOI: 10.1109/TPEL.2018.2872904 [PDF]
Oprins, H.*, Wei, T. W., et al., “A cold shower for chips [J]”, Chip Scale Review, Volume 22, Number 6, November, 2018: Page.26.
Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., Yang, S., & Baelmans, M. (2018, May). 3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (pp. 2389-2396). IEEE. [PDF]
Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., & Baelmans, T. (2018). Nozzle array scaling analysis of the thermal performance of liquid jet impingement coolers for high performance electronic applications. In The 16th International Heat Transfer Conference. The Assembly for International Heat Transfer Conferences; Beijing, China.
2017
Wei, T. W.*, Oprins, H., Cherman, V., Van der Plas, G., De Wolf, I., Beyne, E., & Baelmans, M. (2017, December). High efficiency direct liquid jet impingement cooling of high-power devices using a 3D-shaped polymer cooler. In 2017 IEEE International Electron Devices Meeting (IEDM) (pp. 32-5). IEEE. [PDF]
2015
Wei, T. W., Qiu X., Lo J C C, Ricky L.*. Wafer level bumping technology for high voltage LED packaging[C]//2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2015: 54-57. [PDF]
2014
Wei, T. W., C. Jian*, et al., Optimization and Evaluation of Sputtering Barrier/seed layer In Through Silicon Via for 3-D integration [J], Tsinghua Science and Technology, 2014, 19(2): 150-160. DOI: 10.1109/TST.2014.6787368 [PDF]
Wei, T. W., Cai J.*, et al. Performance and reliability study of TGV interposer in 3D integration[C]//2014 IEEE 16th Electronics Packaging Technology Conference (EPTC). IEEE, 2014: pp. 601-605. [PDF]
2012
Wei, T. W., Wang, Q., Liu, Z., Li, Y., Wang, D., Wang, T., & Cai, J*. (2012, December). A 3D integration testing vehicle with TSV interconnects. In 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (pp. 1-5). IEEE. [PDF]
Wei, T. W., Cai J.*, Wang Q., et al. Copper filling process for small diameter, high aspect ratio through silicon via (TSV)[C]//2012 13th International Conference on Electronic Packaging Technology & High Density Packaging. IEEE, 2012: 483-487. (Outstanding Paper Award) [PDF]