Dr. Ketan Yogi
Post-doctoral Research Fellow (Postdoc @ Indian Institute of technology (IIT) Bombay, 2023)
Shuhang Lyu
PhD Student (M.S. @ Tsinghua University, 2022; B.S. @ North China Electric Power University)
Feifan Xie
PhD Student (B.S. @ Zhejiang University + UIUC; Visiting student @Johns Hopkins University)
Alumni
| STUDENT NAME | DURATION | TITLE | Notes |
| Jaiveer Singh Brar | Fall 2022 | Microbump electroplating for advanced packaging | N/A |
| Chi-Yao Chan | Fall 2022
Spring 2023 |
Surface enhancement of impingement jet cooling | N/A |
| Aksh Iyer | Spring 2023 | Microelectronics packaging: Nano Vias for Future 3D Memory-on-logic architecture | N/A |
| Michael Kurtz | Spring 2023 | Nanoscale Through silicon via (TSV) and Backsdie power delveiry network (BSPDN) Thermal Analysis | N/A |
| Shresth Mathur | Spring 2023 | Semiconductor Chip & 3D Package Manufacturing Process with Focus on Hybrid Bonding | N/A |
| Andrew Modin | Spring 2023 | Thermal Analysis for High-Performance 2.5D Interposer Packages | |
| Aidan Powers | Spring 2023 | Nano TSV Multiscale Modeling | Master student @Purdue |
| Thummuru Keerthi Krishna Reddy | Spring 2023 | Two-Phase Flow loop system design and assembly | N/A |
| Kiet Anh Tran
|
Fall 2022
Spring 2023 |
Electroplating of copper inverse opal (CIO) | N/A |
| Lavinia Barker (Rice)
|
Summer 2023 | SCALE Heterogeneous Integration/ Advanced Packaging: Self-alignment Technology for 3D System Integration | N/A |
| Yubo Song (Purdue) | SURF | Flow visualization system design and experimental | PhD student @Purdue |
| Krishnan, Antariksh Ratna (GT) | Summer 2023 | SCALE Heterogeneous Integration/ Advanced Packaging: 3D Cryogenic Packaging for Superconducting Computing | N/A |
| Modin, Andrew Evan (Purdue) | Summer 2023 | SCALE Heterogeneous Integration/ Advanced Packaging: Simulations of Electroplating for Heterogeneous Integration | Best Poster Presentation Award (5/300)
SCALE SURF |
| Kwon, Ohik (Iowa State University) | Summer 2023 | Backside power delivery electrical modeling | N/A |
| Stephens, Cole Bradford | Fall 2023 | SCLAE 3D Printed Porous Structure For Mircrobump Bonding | Best Poster Presentation Award (3/30) |
| Jaiveer Singh Brar | Fall 2023 | SCALE: Thermal Modeling Analysis in Advanced Back-end-of-line (BEOL) Structures with Different Interconnect/barrier Configurations | Best Poster Presentation Award (3/30) |
Undergraduate Researcher
| STUDENT NAME | DURATION | TITLE | Notes |
| Quan, Ian Xin | Spring 2024 | Permeabiloty and Bursting pressure test | |
| Thorson, Nathan Jon | Spring 2024 | Intel | |
| Payne, Andrew David | Spring 2024 | Glass packaging cooling | |
| Prakash, Tarun | Spring 2024 | Glass embedded package electrical design | |
| Trivedi, Yash Vijay | Spring 2024 | ANSYS Fluent and thermal Mechanical Simulations for Fluid Flow, Thermal, and Electrical projects. Glass cooling for RF pacakge | |
| Pulver, Benjamin Edward | Spring 2024 | Crogenic CFD modelingcooling using microchannel or jet cooling | PhD @Purdue |
| Sun, Qiancheng | Spring 2024 | APR-E reliability modeling | |
| Suresh, Sharan Vishnu | Spring 2024 | Multi-chip cooling | |
| Fang, Peichen | Spring 2024 | Hotspots cooling | |
| Jadallah, Albaraa Khaled | Spring 2024 | Two-phase flow loop software development | |
| Lam, Alexander Hanson | Spring 2024 | Two-phase cooling | |
| Rzendzian, Erek Michael | Spring 2024 | Spray jet cooling design |