Feifan Xie worked as a research assistant at S-PACK Lab. He received his bachelor’s degree at Zhejiang University in 2023. He was an exchange student at UIUC,IL and a visiting undergraduate at Johns Hopkins University, MD. His primary interest is in fluid mechanics and heat transfer and he is working on semiconductor cooling and packaging technologies. He is open to any interesting ideas and study fields. Aside from research, he likes bake and classic music.