This week we welcomed prospective students visiting our lab! We host lab tours and chatted on graduate life.
We had a wonderful BBQ/potluck party with Prof. Li’s ReNEWED lab, thanks everyone for coming!
Andrew, Javieer and Cole won prizes at the SCALE poster show, congratulations!
Prof. Wei delivered Tutorial for IEEE REPP: Thermal Challenges For Heterogeneous Integration Packaging
We thank you for registering for our tutorial, “Thermal Challenges for Heterogeneous Integration Packaging”. It included these two talks: “Cooler Material Reliability Considerations for Bare Die Impingement Cooling in Package” (24:41), Prof. Tiwei Wei, ME Department, Purdue University; and “Development of a High Heat Flux and Ultra-low Thermal Resistance Microcooler” (32:58), Dr. Mehdi Asheghi, ME […]
Dr. Wei, Keyu, and Shuhang travelled to the beautiful San Diego city this week for presenting our work at ASME InterPACK2023! Shuhang’s presentation on two-phase impingement cooling with pin-fin surface enhancement together with Qianying from Stanford nanoheat Keyu’s talk on CIO-assisted microbump bonding for advanced packaging
We showed our work at the 2023 SCALE SURF Symposium! Thank everyone for the great work during the summer. Congratulations!