





Current Research
Featured Publications
Wei, T. W., Lin, Z., Asheghi, M., & Goodson, K. E*., Micro-channel Cooling Technique to Minimize Thermal Deformation of the X-ray and High-power Laser Optics, International Conference on Synchrotron Radiation Instrumentation (SRI) 2022.
Wei, T. W.*, Hazra, S., Asheghi, M., & Goodson, K. E. Numerical Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3D Manifold Coolers. Journal of Electronic Packaging 2022.
Wei, T. W.*, Oprins, H., et al., Heat Transfer and Friction Factor Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets, Int. J. Heat Mass Transf, 2021, Volume 182, 121865.
Media News
Featured News
Wire-to-wire: TSVs may be the key to faster semiconductors
Originial Post: https://engineering.purdue.edu/ME/News/2025/wiretowire-tsvs-may-be-the-key-to-faster-semiconductors As computer processors get smaller and more powerful, semiconductor engineers are running into the physical limits of how fast these chips can operate. One strategy involves stacking chips in 3D and using tiny wires called TSVs (through silicon vias) as vertical connectors. Purdue University researchers are zeroing in on the study of […]
U.S. DOE Secretary Dr. Chris Wright Visits Purdue-Led Team at 2025 ARPA-E Energy Summit
March 18, 2025 – Washington, D.C. – The Honorable Dr. Chris Wright, U.S. Secretary of Energy, made a visit to the Purdue University-led research team during the 2025 ARPA-E Energy Innovation Summit. Dr. Wright experienced a live demonstration of the team’s innovative in-package direct-on-chip two-phase cooling technology, that is aimed at addressing the thermal challenges […]
Congratulations on Prof. Wei’s Winning Intel 2024 Rising Star Faculty Award!
Check the news out at Purdue ME website: Tiwei Wei receives Intel’s 2024 Rising Star Faculty Award – Mechanical Engineering – Purdue University Tiwei Wei’s research focuses on solving the fabrication challenges and heat transfer issues in advanced semiconductor packaging and assembly. He is developing new materials and techniques for scaling 3D interconnect density, including […]
S-PACK Team Showcases Groundbreaking Cooling Technology at ARPA-E Energy Innovation Summit 2024
Dallas, TX – [May 24, 2024] The S-PACK research lab at Purdue, in collaboration with Cooling Technologies Research Center, SEGUENTE, and Binghamton University, proudly showcased our latest innovation in cooling technology at the ARPA-E Energy Innovation Summit 2024. The highlight of the event was the visit from the Honorable ARPA-E Director, Dr. Evelyn Wang, who […]