Current Research

Surface Engineering Enhancement of Advanced Cooling Technology

Surface Engineering Enhancement of Advanced Cooling Technology

Micro-bump Bonding, Cu/dielectric Hybrid Bonding and Characterization

Micro-bump Bonding, Cu/dielectric Hybrid Bonding and Characterization

Through Glass Via for 3D Heterogenous Integration

Through Glass Via for 3D Heterogenous Integration

Advanced Semiconductor Nanoscale 3D Interconnections

Advanced Semiconductor Nanoscale 3D Interconnections

Hot Spots Targeted Cooling Technologies

Hot Spots Targeted Cooling Technologies

Thermomechanical Reliability Modeling & Characterization of Advanced Packaging

Thermomechanical Reliability Modeling & Characterization of Advanced Packaging

Materials, Processing & Architecture Development for Semiconductor Packaging

Materials, Processing & Architecture Development for Semiconductor Packaging

Electronic Cooling & Efficient Thermal Packaging Materials

Electronic Cooling & Efficient Thermal Packaging Materials

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Featured Publications

Wei, T. W., Lin, Z., Asheghi, M., & Goodson, K. E*., Micro-channel Cooling Technique to Minimize Thermal Deformation of the X-ray and High-power Laser Optics, International Conference on Synchrotron Radiation Instrumentation (SRI) 2022.

Wei, T. W.*, Hazra, S., Asheghi, M., & Goodson, K. E. Numerical Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3D Manifold Coolers. Journal of Electronic Packaging 2022.

Wei, T. W.*, Oprins, H., et al., Heat Transfer and Friction Factor Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets, Int. J. Heat Mass Transf, 2021, Volume 182, 121865.

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Media News

The next generation of wireless systems may be built on microjet-cooled glass

All-in-one design integrates microfluidic cooling into electronic chips

Making Semiconductors Dense and Cool

Revolutionizing data center cooling: A path to energy efficiency and sustainability

From micro to macro: cooling data centers from the inside out

Is Chip Cooling the Answer to Data Center Sustainability?

Breakthroughs in 3D Chip Technology Lead to Cooling With Microfluidics and 3D Printing

Spray-on Cooling

Imec demonstrates efficient cost-effective cooling solution for high performance chips

A cold shower for chips

Featured News

Prof. Wei delivered Tutorial for IEEE REPP: Thermal Challenges For Heterogeneous Integration Packaging

We thank you for registering for our tutorial, “Thermal Challenges for Heterogeneous Integration Packaging”.  It included these two talks: “Cooler Material Reliability Considerations for Bare Die Impingement Cooling in Package” (24:41), Prof. Tiwei Wei, ME Department, Purdue University; and “Development of a High Heat Flux and Ultra-low Thermal Resistance Microcooler” (32:58), Dr. Mehdi Asheghi, ME […]

Presenting Our Work at ASME InterPACK2023!

Dr. Wei, Keyu, and Shuhang travelled to the beautiful San Diego city this week for presenting our work at ASME InterPACK2023! Shuhang’s presentation on two-phase impingement cooling with pin-fin surface enhancement together with Qianying from Stanford nanoheat Keyu’s talk on CIO-assisted microbump bonding for advanced packaging  

New Postdoc Position Available!

Our lab has a new postdoc position available with the topic of AI-driven design of hotspot-targeted microjet impingement systems. Please click the link below for details:   Physics-informed AI-Driven Design and Fabrication of Hotspots-Targeted Microjet Cooling for High-Performance Computation Systems https://engineering.purdue.edu/Engr/Research/GilbrethFellowships/ResearchProposals/2024-25/physicsinformed-aidriven-design-and-fabrication-of-hotspotstargeted-microjet-cooling-for-highperformance-computation-systems

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