Featured Publications

Wei, T. W., Lin, Z., Asheghi, M., & Goodson, K. E*., Micro-channel Cooling Technique to Minimize Thermal Deformation of the X-ray and High-power Laser Optics, International Conference on Synchrotron Radiation Instrumentation (SRI) 2022.

Wei, T. W.*, Hazra, S., Asheghi, M., & Goodson, K. E. Numerical Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3D Manifold Coolers. Journal of Electronic Packaging 2022.

Wei, T. W.*, Oprins, H., et al., Heat Transfer and Friction Factor Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets, Int. J. Heat Mass Transf, 2021, Volume 182, 121865.

Featured News

Congratulations on Prof. Wei’s Winning Intel 2024 Rising Star Faculty Award!

Check the news out at Purdue ME website: Tiwei Wei receives Intel’s 2024 Rising Star Faculty Award – Mechanical Engineering – Purdue University Tiwei Wei’s research focuses on solving the fabrication challenges and heat transfer issues in advanced semiconductor packaging and assembly. He is developing new materials and techniques for scaling 3D interconnect density, including […]

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