Prof. Wei delivered Tutorial for IEEE REPP: Thermal Challenges For Heterogeneous Integration Packaging
We thank you for registering for our tutorial, “Thermal Challenges for Heterogeneous Integration Packaging”. It included these two talks: “Cooler Material Reliability Considerations for Bare Die Impingement Cooling in Package” (24:41), Prof. Tiwei Wei, ME Department, Purdue University; and “Development of a High Heat Flux and Ultra-low Thermal Resistance Microcooler” (32:58), Dr. Mehdi Asheghi, ME […]
Dr. Wei, Keyu, and Shuhang travelled to the beautiful San Diego city this week for presenting our work at ASME InterPACK2023! Shuhang’s presentation on two-phase impingement cooling with pin-fin surface enhancement together with Qianying from Stanford nanoheat Keyu’s talk on CIO-assisted microbump bonding for advanced packaging
We met with our new incoming students, Piyush, Yubo and Ridham on Zoom today. Thanks everyone for your introduction and masterpieces of drawing!
We showed our work at the 2023 SCALE SURF Symposium! Thank everyone for the great work during the summer. Congratulations!
We had an exciting BBQ organized in collaboration with Prof. Yan Gu’s group. What a memorable gathering! Prof. Yan Gu’s group (TRACE lab): [Group link: https://www.thetracelab.com/team.html ]
Our lab has a new postdoc position available with the topic of AI-driven design of hotspot-targeted microjet impingement systems. Please click the link below for details: Physics-informed AI-Driven Design and Fabrication of Hotspots-Targeted Microjet Cooling for High-Performance Computation Systems https://engineering.purdue.edu/Engr/Research/GilbrethFellowships/ResearchProposals/2024-25/physicsinformed-aidriven-design-and-fabrication-of-hotspotstargeted-microjet-cooling-for-highperformance-computation-systems