Semiconductor Integration & Multiphysics Reliability Laboratory

Current Research

Surface Engineering Enhancement of Advanced Cooling Technology

Micro-bump Bonding, Cu/dielectric Hybrid Bonding and Characterization

Through Glass Via for 3D Heterogenous Integration

Advanced Semiconductor Nanoscale 3D Interconnections

Hot Spots Targeted Cooling Technologies

Thermomechanical Reliability Modeling & Characterization of Advanced Packaging

Materials, Processing & Architecture Development for Semiconductor Packaging

Electronic Cooling & Efficient Thermal Packaging Materials

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Featured Publications

Wei, T. W., Lin, Z., Asheghi, M., & Goodson, K. E*., Micro-channel Cooling Technique to Minimize Thermal Deformation of the X-ray and High-power Laser Optics, International Conference on Synchrotron Radiation Instrumentation (SRI) 2022.

Wei, T. W.*, Hazra, S., Asheghi, M., & Goodson, K. E. Numerical Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3D Manifold Coolers. Journal of Electronic Packaging 2022.

Wei, T. W.*, Oprins, H., et al., Heat Transfer and Friction Factor Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets, Int. J. Heat Mass Transf, 2021, Volume 182, 121865.

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Media News

The next generation of wireless systems may be built on microjet-cooled glass

All-in-one design integrates microfluidic cooling into electronic chips

Making Semiconductors Dense and Cool

Revolutionizing data center cooling: A path to energy efficiency and sustainability

From micro to macro: cooling data centers from the inside out

Is Chip Cooling the Answer to Data Center Sustainability?

Breakthroughs in 3D Chip Technology Lead to Cooling With Microfluidics and 3D Printing

Spray-on Cooling

Imec demonstrates efficient cost-effective cooling solution for high performance chips

A cold shower for chips

Featured News

Tiwei Wei receives the 2026 IEEE EPS – IEEE Electronics Packaging Society “Exceptional Technical Achievement Award”

Tiwei Wei, Assistant Professor of Mechanical and Aerospace Engineering at the UCLA Samueli School of Engineering, has been selected as the recipient of the 2026 IEEE Electronics Packaging Society (EPS) Exceptional Technical Achievement Award. He is being recognized for his pioneering contributions to thermal management technologies for 2.5D and 3D system integration, including advances in […]

Celebrating the Spring 2026 Doctoral Commencement of Shuhang Lyu and Zhengwei Chen

We proudly congratulate Shuhang Lyu and Zhengwei Chen on their participation in the Spring 2026 Doctoral Commencement Ceremony. Their graduation marks the successful completion of years of hard work, dedication, and research. We are grateful for their contributions to our research lab and are excited to see what they accomplish next. We wish both Shuhang […]

Celebrating Dr. Zhengwei Chen’s Successful PhD Defense and Research Contributions

We are delighted to share that Dr. Zhengwei Chen has successfully passed his PhD public defense. He has been co-advised by Prof. Tiwei Wei and Prof. Amy Marconnet throughout his doctoral studies. Dr. Chen’s research has advanced the field of thermal management for next-generation heterogeneous integration and 3D packaging systems, addressing key challenges in heat […]

Celebrating Our First PhD Graduate: Shuhang Lyu

We are proud to share a historic milestone for our group! Our very first PhD student, Dr. Shuhang Lyu, co-advised with Prof. Thomas Beechem, has successfully passed his final PhD defense. His dissertation, “Understanding Thermomechanical Response of Scaled Through Silicon Vias for High-Density 3D Packaging,” provides important insights into reliability challenges in next-generation microelectronic systems. […]

Prof. Tiwei Wei and Graduate Student Ye Yang Honored at ASME InterPACK 2025

Anaheim, CA — At the ASME Electronic and Photonic Packaging Division’s InterPACK 2025 conference, Prof. Tiwei Wei received the prestigious EPPD Early Career Engineer Award in recognition of his contributions to electronic and photonic packaging. Prof. Wei expressed gratitude to mentors, collaborators, and students for their continuous support, noting that the honor further motivates his […]

Wire-to-wire: TSVs may be the key to faster semiconductors

Originial Post: https://engineering.purdue.edu/ME/News/2025/wiretowire-tsvs-may-be-the-key-to-faster-semiconductors As computer processors get smaller and more powerful, semiconductor engineers are running into the physical limits of how fast these chips can operate. One strategy involves stacking chips in 3D and using tiny wires called TSVs (through silicon vias) as vertical connectors. Purdue University researchers are zeroing in on the study of […]

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