Current Research
Featured Publications
Wei, T. W., Lin, Z., Asheghi, M., & Goodson, K. E*., Micro-channel Cooling Technique to Minimize Thermal Deformation of the X-ray and High-power Laser Optics, International Conference on Synchrotron Radiation Instrumentation (SRI) 2022.
Wei, T. W.*, Hazra, S., Asheghi, M., & Goodson, K. E. Numerical Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3D Manifold Coolers. Journal of Electronic Packaging 2022.
Wei, T. W.*, Oprins, H., et al., Heat Transfer and Friction Factor Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets, Int. J. Heat Mass Transf, 2021, Volume 182, 121865.
Media News
Featured News
Prof. Wei’s Seminar Talk on Advanced Manufacturing for Semiconductor Packaging and Electronic Cooling
Prof. Wei talked about Advanced Packaging Technology and Electronics Cooling at Birck. The video recording can be found at IEEE TV: Advanced Manufacturing for Semiconductor Packaging and Electronics Cooling | IEEETV
Aaron Presenting at Spring Undergraduate Research Conference
Our high school intern student, Aaron Du, presented his work titled “Electrodeposition in Through-Silicon Vias Using an Impinging Jet Electrode” at Spring Undergraduate Research Conference 2024!
Group Diner Spring 2024
Welcome our new members and happy spring semester!
Graduate Visitation Week
This week we welcomed prospective students visiting our lab! We host lab tours and chatted on graduate life.
Lunch Party ft. S-PACK & ReNEWED lab
We had a wonderful BBQ/potluck party with Prof. Li’s ReNEWED lab, thanks everyone for coming!
S-PACK Undergraduates Shine Bright at SCALE Event!
Andrew, Javieer and Cole won prizes at the SCALE poster show, congratulations!