Prof. Wei’s Seminar Talk on Advanced Manufacturing for Semiconductor Packaging and Electronic Cooling
Prof. Wei talked about Advanced Packaging Technology and Electronics Cooling at Birck. The video recording can be found at IEEE TV: Advanced Manufacturing for Semiconductor Packaging and Electronics Cooling | IEEETV
Aaron Presenting at Spring Undergraduate Research Conference
Our high school intern student, Aaron Du, presented his work titled “Electrodeposition in Through-Silicon Vias Using an Impinging Jet Electrode” at Spring Undergraduate Research Conference 2024!
Group Diner Spring 2024
Welcome our new members and happy spring semester!
Graduate Visitation Week
This week we welcomed prospective students visiting our lab! We host lab tours and chatted on graduate life.
Lunch Party ft. S-PACK & ReNEWED lab
We had a wonderful BBQ/potluck party with Prof. Li’s ReNEWED lab, thanks everyone for coming!
S-PACK Undergraduates Shine Bright at SCALE Event!
Andrew, Javieer and Cole won prizes at the SCALE poster show, congratulations!
Presenting Our Work at ASME InterPACK2023!
Dr. Wei, Keyu, and Shuhang travelled to the beautiful San Diego city this week for presenting our work at ASME InterPACK2023! Shuhang’s presentation on two-phase impingement cooling with pin-fin surface enhancement together with Qianying from Stanford nanoheat Keyu’s talk on CIO-assisted microbump bonding for advanced packaging
AlphaLab at 2023 SCALE SURF
We showed our work at the 2023 SCALE SURF Symposium! Thank everyone for the great work during the summer. Congratulations!
Alpha Lab and TRACE Lab BBQ
We had an exciting BBQ organized in collaboration with Prof. Yan Gu’s group. What a memorable gathering! Prof. Yan Gu’s group (TRACE lab): [Group link: https://www.thetracelab.com/team.html ]