March 18, 2025 – Washington, D.C. – The Honorable Dr. Chris Wright, U.S. Secretary of Energy, made a visit to the Purdue University-led research team during the 2025 ARPA-E Energy Innovation Summit. Dr. Wright experienced a live demonstration of the team’s innovative in-package direct-on-chip two-phase cooling technology, that is aimed at addressing the thermal challenges […]
Check the news out at Purdue ME website: Tiwei Wei receives Intel’s 2024 Rising Star Faculty Award – Mechanical Engineering – Purdue University Tiwei Wei’s research focuses on solving the fabrication challenges and heat transfer issues in advanced semiconductor packaging and assembly. He is developing new materials and techniques for scaling 3D interconnect density, including […]
Dallas, TX – [May 24, 2024] The S-PACK research lab at Purdue, in collaboration with Cooling Technologies Research Center, SEGUENTE, and Binghamton University, proudly showcased our latest innovation in cooling technology at the ARPA-E Energy Innovation Summit 2024. The highlight of the event was the visit from the Honorable ARPA-E Director, Dr. Evelyn Wang, who […]
Prof. Wei talked about Advanced Packaging Technology and Electronics Cooling at Birck. The video recording can be found at IEEE TV: Advanced Manufacturing for Semiconductor Packaging and Electronics Cooling | IEEETV
Our high school intern student, Aaron Du, presented his work titled “Electrodeposition in Through-Silicon Vias Using an Impinging Jet Electrode” at Spring Undergraduate Research Conference 2024!
Welcome our new members and happy spring semester!
This week we welcomed prospective students visiting our lab! We host lab tours and chatted on graduate life.
