Fun-Filled Day: S-PACK Members Enjoy Bowling and BBQ Hangout
Dallas, TX – [May 24, 2024] The S-PACK research lab at Purdue, in collaboration with Cooling Technologies Research Center, SEGUENTE, and Binghamton University, proudly showcased our latest innovation in cooling technology at the ARPA-E Energy Innovation Summit 2024. The highlight of the event was the visit from the Honorable ARPA-E Director, Dr. Evelyn Wang, who […]
Prof. Wei talked about Advanced Packaging Technology and Electronics Cooling at Birck. The video recording can be found at IEEE TV: Advanced Manufacturing for Semiconductor Packaging and Electronics Cooling | IEEETV
Our high school intern student, Aaron Du, presented his work titled “Electrodeposition in Through-Silicon Vias Using an Impinging Jet Electrode” at Spring Undergraduate Research Conference 2024!
Welcome our new members and happy spring semester!
This week we welcomed prospective students visiting our lab! We host lab tours and chatted on graduate life.
We had a wonderful BBQ/potluck party with Prof. Li’s ReNEWED lab, thanks everyone for coming!
Andrew, Javieer and Cole won prizes at the SCALE poster show, congratulations!
Dr. Wei, Keyu, and Shuhang travelled to the beautiful San Diego city this week for presenting our work at ASME InterPACK2023! Shuhang’s presentation on two-phase impingement cooling with pin-fin surface enhancement together with Qianying from Stanford nanoheat Keyu’s talk on CIO-assisted microbump bonding for advanced packaging