S-PACK Undergraduates Shine Bright at SCALE Event!
Andrew, Javieer and Cole won prizes at the SCALE poster show, congratulations!
Andrew, Javieer and Cole won prizes at the SCALE poster show, congratulations!
Dr. Wei, Keyu, and Shuhang travelled to the beautiful San Diego city this week for presenting our work at ASME InterPACK2023! Shuhang’s presentation on two-phase impingement cooling with pin-fin surface enhancement together with Qianying from Stanford nanoheat Keyu’s talk on CIO-assisted microbump bonding for advanced packaging
We showed our work at the 2023 SCALE SURF Symposium! Thank everyone for the great work during the summer. Congratulations!
We had an exciting BBQ organized in collaboration with Prof. Yan Gu’s group. What a memorable gathering! Prof. Yan Gu’s group (TRACE lab): [Group link: https://www.thetracelab.com/team.html ]
Our lab has a new postdoc position available with the topic of AI-driven design of hotspot-targeted microjet impingement systems. Please click the link below for details: Physics-informed AI-Driven Design and Fabrication of Hotspots-Targeted Microjet Cooling for High-Performance Computation Systems https://engineering.purdue.edu/Engr/Research/GilbrethFellowships/ResearchProposals/2024-25/physicsinformed-aidriven-design-and-fabrication-of-hotspotstargeted-microjet-cooling-for-highperformance-computation-systems
The short course was great – we had 59 ppl logged in and learning from Tiwei! POETS VIRTUAL COURSE SERIES REGISTER HERE Course Summary: Thermal management directly impacts the cost, performance, and reliability of the electronic/electrical components and systems in wide ranging applications including computing, communications, defense systems etc. The electrification of transportation is one of the […]
Prof. Wei and Shuhang attended IEEE ITherm and ECTC 2023! Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2023 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. At this year’s event, Purdue faculty were very involved in the conference organization: Amy Marconnet was […]
Dr. Wei’s team has received a $1.9 million Department of Energy grant to help make data centers more energy efficient! See the news from Purdue ME for the details: From micro to macro: cooling data centers from the inside out – Mechanical Engineering – Purdue University
Welcome our incoming master student Akshat Patel! Thanks for his nice presentation on his previous research. Also thank everyone for their nice drawing!
Welcome Keyu, Feifan and Akshat!