Dr. Wei, Keyu, and Shuhang travelled to the beautiful San Diego city this week for presenting our work at ASME InterPACK2023! Shuhang’s presentation on two-phase impingement cooling with pin-fin surface enhancement together with Qianying from Stanford nanoheat Keyu’s talk on CIO-assisted microbump bonding for advanced packaging
We showed our work at the 2023 SCALE SURF Symposium! Thank everyone for the great work during the summer. Congratulations!
We had an exciting BBQ organized in collaboration with Prof. Yan Gu’s group. What a memorable gathering! Prof. Yan Gu’s group (TRACE lab): [Group link: https://www.thetracelab.com/team.html ]
Prof. Wei and Shuhang attended IEEE ITherm and ECTC 2023! Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2023 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. At this year’s event, Purdue faculty were very involved in the conference organization: Amy Marconnet was […]
Dr. Wei’s team has received a $1.9 million Department of Energy grant to help make data centers more energy efficient! See the news from Purdue ME for the details: From micro to macro: cooling data centers from the inside out – Mechanical Engineering – Purdue University
Welcome our incoming master student Akshat Patel! Thanks for his nice presentation on his previous research. Also thank everyone for their nice drawing!
We posted a featured blog on the CoE Medium homepage to introduce our lab! Making semiconductors dense and cool | by Purdue College of Engineering | Purdue Engineering Review | Jan, 2023 | Medium
