Contact

Tiwei Wei: Semiconductor Packaging, Heat Transfer, and Assembly

Principal Investigator

Tiwei Wei, Ph.D.

Assistant Professor, Mechanical and Aerospace Engineering

Associate Director, UCLA CHIPS

University of California, Los Angeles

420 Westwood Plaza, 37-144 Engineering IV Bldg

Phone: 650-505-6084, Email: tiwei32@ucla.edu

https://samueli.ucla.edu/people/tiwei-wei-starting-july-2025/

Research Group: S-PACK Lab https://s-pack.org/

Laboratory

University of California, Los Angeles

420 Westwood Plaza, 14-129 Engineering IV Bldg