Prof. Wei’s Seminar Talk on Advanced Manufacturing for Semiconductor Packaging and Electronic Cooling
Prof. Wei talked about Advanced Packaging Technology and Electronics Cooling at Birck. The video recording can be found at IEEE TV: Advanced Manufacturing for Semiconductor Packaging and Electronics Cooling | IEEETV
Aaron Presenting at Spring Undergraduate Research Conference
Our high school intern student, Aaron Du, presented his work titled “Electrodeposition in Through-Silicon Vias Using an Impinging Jet Electrode” at Spring Undergraduate Research Conference 2024!
Prof. Wei delivered Tutorial for IEEE REPP: Thermal Challenges For Heterogeneous Integration Packaging
We thank you for registering for our tutorial, “Thermal Challenges for Heterogeneous Integration Packaging”. It included these two talks: “Cooler Material Reliability Considerations for Bare Die Impingement Cooling in Package” (24:41), Prof. Tiwei Wei, ME Department, Purdue University; and “Development of a High Heat Flux and Ultra-low Thermal Resistance Microcooler” (32:58), Dr. Mehdi Asheghi, ME […]
Presenting Our Work at ASME InterPACK2023!
Dr. Wei, Keyu, and Shuhang travelled to the beautiful San Diego city this week for presenting our work at ASME InterPACK2023! Shuhang’s presentation on two-phase impingement cooling with pin-fin surface enhancement together with Qianying from Stanford nanoheat Keyu’s talk on CIO-assisted microbump bonding for advanced packaging
AlphaLab at 2023 SCALE SURF
We showed our work at the 2023 SCALE SURF Symposium! Thank everyone for the great work during the summer. Congratulations!
New Postdoc Position Available!
Our lab has a new postdoc position available with the topic of AI-driven design of hotspot-targeted microjet impingement systems. Please click the link below for details: Physics-informed AI-Driven Design and Fabrication of Hotspots-Targeted Microjet Cooling for High-Performance Computation Systems https://engineering.purdue.edu/Engr/Research/GilbrethFellowships/ResearchProposals/2024-25/physicsinformed-aidriven-design-and-fabrication-of-hotspotstargeted-microjet-cooling-for-highperformance-computation-systems
Prof. Wei delivered a 2-hour short course at NSF POETS Center
The short course was great – we had 59 ppl logged in and learning from Tiwei! POETS VIRTUAL COURSE SERIES REGISTER HERE Course Summary: Thermal management directly impacts the cost, performance, and reliability of the electronic/electrical components and systems in wide ranging applications including computing, communications, defense systems etc. The electrification of transportation is one of the […]
Attending ITherm 2023
Prof. Wei and Shuhang attended IEEE ITherm and ECTC 2023! Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2023 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. At this year’s event, Purdue faculty were very involved in the conference organization: Amy Marconnet was […]
From micro to macro: cooling data centers from the inside out
Dr. Wei’s team has received a $1.9 million Department of Energy grant to help make data centers more energy efficient! See the news from Purdue ME for the details: From micro to macro: cooling data centers from the inside out – Mechanical Engineering – Purdue University