Wire-to-wire: TSVs may be the key to faster semiconductors
Originial Post: https://engineering.purdue.edu/ME/News/2025/wiretowire-tsvs-may-be-the-key-to-faster-semiconductors As computer processors get smaller and more powerful, semiconductor engineers are running into the physical limits of how fast these chips can operate. One strategy involves stacking chips in 3D and using tiny wires called TSVs (through silicon vias) as vertical connectors. Purdue University researchers are zeroing in on the study of […]
U.S. DOE Secretary Dr. Chris Wright Visits Purdue-Led Team at 2025 ARPA-E Energy Summit
March 18, 2025 – Washington, D.C. – The Honorable Dr. Chris Wright, U.S. Secretary of Energy, made a visit to the Purdue University-led research team during the 2025 ARPA-E Energy Innovation Summit. Dr. Wright experienced a live demonstration of the team’s innovative in-package direct-on-chip two-phase cooling technology, that is aimed at addressing the thermal challenges […]
Congratulations on Prof. Wei’s Winning Intel 2024 Rising Star Faculty Award!
Check the news out at Purdue ME website: Tiwei Wei receives Intel’s 2024 Rising Star Faculty Award – Mechanical Engineering – Purdue University Tiwei Wei’s research focuses on solving the fabrication challenges and heat transfer issues in advanced semiconductor packaging and assembly. He is developing new materials and techniques for scaling 3D interconnect density, including […]
S-PACK Team Showcases Groundbreaking Cooling Technology at ARPA-E Energy Innovation Summit 2024
Dallas, TX – [May 24, 2024] The S-PACK research lab at Purdue, in collaboration with Cooling Technologies Research Center, SEGUENTE, and Binghamton University, proudly showcased our latest innovation in cooling technology at the ARPA-E Energy Innovation Summit 2024. The highlight of the event was the visit from the Honorable ARPA-E Director, Dr. Evelyn Wang, who […]
Prof. Wei’s Seminar Talk on Advanced Manufacturing for Semiconductor Packaging and Electronic Cooling
Prof. Wei talked about Advanced Packaging Technology and Electronics Cooling at Birck. The video recording can be found at IEEE TV: Advanced Manufacturing for Semiconductor Packaging and Electronics Cooling | IEEETV
Aaron Presenting at Spring Undergraduate Research Conference
Our high school intern student, Aaron Du, presented his work titled “Electrodeposition in Through-Silicon Vias Using an Impinging Jet Electrode” at Spring Undergraduate Research Conference 2024!
Prof. Wei delivered Tutorial for IEEE REPP: Thermal Challenges For Heterogeneous Integration Packaging
We thank you for registering for our tutorial, “Thermal Challenges for Heterogeneous Integration Packaging”. It included these two talks: “Cooler Material Reliability Considerations for Bare Die Impingement Cooling in Package” (24:41), Prof. Tiwei Wei, ME Department, Purdue University; and “Development of a High Heat Flux and Ultra-low Thermal Resistance Microcooler” (32:58), Dr. Mehdi Asheghi, ME […]
Presenting Our Work at ASME InterPACK2023!
Dr. Wei, Keyu, and Shuhang travelled to the beautiful San Diego city this week for presenting our work at ASME InterPACK2023! Shuhang’s presentation on two-phase impingement cooling with pin-fin surface enhancement together with Qianying from Stanford nanoheat Keyu’s talk on CIO-assisted microbump bonding for advanced packaging
AlphaLab at 2023 SCALE SURF
We showed our work at the 2023 SCALE SURF Symposium! Thank everyone for the great work during the summer. Congratulations!