Prof. Wei delivered Tutorial for IEEE REPP: Thermal Challenges For Heterogeneous Integration Packaging

We thank you for registering for our tutorial, “Thermal Challenges for Heterogeneous Integration Packaging”.  It included these two talks: “Cooler Material Reliability Considerations for Bare Die Impingement Cooling in Package” (24:41), Prof. Tiwei Wei, ME Department, Purdue University; and “Development of a High Heat Flux and Ultra-low Thermal Resistance Microcooler” (32:58), Dr. Mehdi Asheghi, ME […]

Presenting Our Work at ASME InterPACK2023!

Dr. Wei, Keyu, and Shuhang travelled to the beautiful San Diego city this week for presenting our work at ASME InterPACK2023! Shuhang’s presentation on two-phase impingement cooling with pin-fin surface enhancement together with Qianying from Stanford nanoheat Keyu’s talk on CIO-assisted microbump bonding for advanced packaging  

New Postdoc Position Available!

New Postdoc Position Available!

Our lab has a new postdoc position available with the topic of AI-driven design of hotspot-targeted microjet impingement systems. Please click the link below for details:   Physics-informed AI-Driven Design and Fabrication of Hotspots-Targeted Microjet Cooling for High-Performance Computation Systems

Prof. Wei delivered a 2-hour short course at NSF POETS Center

The short course was great – we had 59 ppl logged in and learning from Tiwei! POETS VIRTUAL COURSE SERIES REGISTER HERE Course Summary:  Thermal management directly impacts the cost, performance, and reliability of the electronic/electrical components and systems in wide ranging applications including computing, communications, defense systems etc.  The electrification of transportation is one of the […]

Attending ITherm 2023

Prof. Wei and Shuhang attended IEEE ITherm and ECTC 2023! Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2023 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. At this year’s event, Purdue faculty were very involved in the conference organization: Amy Marconnet was […]