Dr. Tiwei Wei is an Assistant Professor at Purdue University, School of Mechanical Engineering. He was a postdoctoral research scholar in the NanoHeat lab at Stanford University. He received his Ph.D. degree in the 3D system integration department at Interuniversity Microelectronics Centre (imec) and KU Leuven, Belgium in 2020. He joined imec in 2015, starting the Ph.D. research with developing electronic cooling solutions for high-performance 3D systems. Before joining imec, he worked as a researcher staff in Tsinghua University and Hong Kong University of Science and Technology, from 2011 until 2015, where he worked on advanced microelectronic packaging techniques. His current research interest is focusing on Advanced Semiconductor Packaging and Heterogeneous Integration covering processing, materials, and architecture development, Chip-Package Interactions, Reliability, and Efficient thermal management technologies. He serves on the session chair and technical program committee of several electronic packaging conferences, including IEEE ESTC, REPP, 3DIC and EPTC. He is currently the vice-chair of IEEE Electronic Packaging Society (EPS) Silicon Valley Chapter.