Facilities

Flip chip bonder

FINEPLACER® lambda 2

Micro assembly system with placement accuracy 0.5 μm, ideal for component sizes ranging from 0.03 mm x 0.03 mm to 20 mm x 20 mm.

Thermo-compression – Thermosonic
– Ultrasonic - Soldering (AuSn, C4, Indium) - Adhesive technologies - Curing (UV, thermal) – Mechanical assembly

Polisher

Grinder/polisher/CMP

potentiostat/galvanostat

Potentiostat

The new 620, replacement for the Reference 600+™, is a high-performance potentiostat/galvanostat/ZRA particularly suitable for applications in physical electrochemistry, sensors, coatings, and corrosion.

Key features of the 620 include:

  • Designed for fast, low-current measurements
  • Maximum Applied Potential – ±11 V
  • EIS – 10 μHz – 5 MHz
  • For techniques including:
  • Physical Electrochemistry
  • Pulse Voltammetry
  • Electrochemical Energy
Flow loop system for electronic cooling

Flow loop system for electronic cooling

  1. Fluid Flow Control
  2. Temperature/Pressure Measurement
  3. Fluid Temperature/Pressure Control
Workstations for computing

Computation: ANSYS and COMSOL

3D-printed Electroplating Setup

Electroplating setup for advanced packaging

Environmental chamber

Environmental chamber

Die attach machine equipment

Die attach machine equipment

Titrator

AUTOTITRATOR

Microscopy-1

Microscope-1

Microscopy-3

Microscope-2

Microscopy-2

Microscope-3