The Thermal Science Laboratory for Semiconductor Packaging & Integration studies fundamental thermal and transport phenomena governing next-generation semiconductor systems. Our research spans heat transfer, thermal transport, thermomechanics, phase change, and multiscale materials behavior, from nanoscale interfaces and interconnects to 2.5D/3D integrated chips and package-level architectures.

We combine physics-based modeling, materials engineering, micro/nanofabrication, and experimental characterization to develop new approaches for managing extreme heat fluxes and improving the reliability of advanced electronics. Our research includes 3D semiconductor thermal transport, thermal materials and interfaces, grain engineering, thermomechanical reliability, direct-on-chip cooling, two-phase boiling and phase separation, and thermal isolation for AI, high-performance computing, and power electronics.