Energy-Efficient Direct-on-Chip Cooling for Power Electronics and Data Centers

Our research develops energy-efficient, direct-on-chip cooling technologies for next-generation power electronics and data centers, with a focus on managing extreme heat fluxes while minimizing pumping and system-level energy consumption. Through our ARPA-E COOLERCHIPS program, we are developing and experimentally demonstrating single- and two-phase jet impingement cooling, including direct-on-chip two-phase cooling architectures that exploit phase change to achieve high heat-transfer rates with compact form factors. In parallel, we investigate embedded microchannel cooling architectures that integrate high-density flow passages directly within electronic substrates and packages, enabling localized cooling of high-power hotspots and reducing thermal resistance.

Beyond conventional microfluidic architectures, our work explores fundamental phase-separation mechanisms to control liquid and vapor transport in confined cooling systems, as well as surface engineering and 3D-printed hierarchical structures to enhance nucleation, liquid spreading, vapor removal, and heat transfer. By combining multiphase transport physics, engineered surfaces, advanced manufacturing, and integrated microfluidics, we aim to develop scalable cooling solutions that simultaneously deliver high heat flux capability, low thermal resistance, and high energy efficiency for future electronics and data centers.