Advanced liquid cooling solutions are needed to address the thermal challenges of next-generation high-power density 3D integration systems. Impingement jet cooling shows great potential for hotspot-targeted cooling. In the case of hotspot power dissipation patterns, the location of the impinging jet nozzles ejecting the coolant onto the chip can be aligned to the hotspot locations. However, the current state-of-art hotspot-targeted cooling solutions could not handle the dynamically changed power dissipations.

Publications

Lyu, Shuhang, Qianying Wu, and Tiwei Wei. "Hotspot-targeted Cooling Scheme with Hybrid Jet Impingement/Thermal Through Silicon Via (TSV)." 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2023.
Lin, Y., Wei, T. W., Asheghi, M., Goodson, K. E.*, The Capillary-driven Two-phase Embedded Microchannel Heatsink for the Efficient Cooling of Power Electronic Modules, Bulletin of the American Physical Society, 2023
Chen H, Wei, T. W., et al. Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler[C]//2022 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE, 2022: 962-965. DOI: 10.1109/APEC43599.2022.9773698 [PDF]
Chen, H., Wei, T. W., Li, X., Chen, Y., Lin, Y., Chinnaiyan, S., Asheghi, M., Mantooth, H. A., Demonstration of Wire bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler, 2022 IEEE Energy Conversion Congress and Exposition [PDF]
Hazra, S.*, Wei, T. W., Lin, Y., Asheghi, M, Goodson, K., Gupta M. P., Degner M., Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling, International Journal of Heat and Mass Transfer, 2022, 197, 123356. [PDF]
Wei, T. W.*, Oprins, H., et al., Heat Transfer and Friction Factor Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets, Int. J. Heat Mass Transf, 2021, Volume 182, 121865. DOI: 10.1016/j.ijheatmasstransfer.2021.121865 [PDF]
Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, T., Nozzle Scaling Effects for the Thermohydraulic Performance of Microjet Impingement Cooling with Distributed Returns, Applied Thermal Engineering, Volume 180, 5 November 2020, 115767. DOI: 10.1016/j.applthermaleng.2020.115767 [PDF]
Wei, T. W.*, All-in-one design integrates microfluidic cooling into electronic chips, Nature, News and Views, 585, 188-189. (2020) (Invited) DOI: 10.1038/d41586-020-02503-1 [PDF]
Wei, T. W.*, Oprins, H., et al., Experimental and Numerical Study of 3D Printed Direct Jet Impingement Cooling for High Power, Large Die Size Applications, in IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020. DOI: 10.1109/TCPMT.2020.3045113 [PDF]
Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2020). Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5 D integrated systems. Applied Thermal Engineering, 2020, 164, 114535. DOI: 10.1016/j.applthermaleng.2019.114535 [PDF]
Wei, T. W.*, Oprins, H., Cherman, V., Yang, Z., Rivera, K., Van der Plas, G., Pawlak, B. J., England, L., Beyne, E., & Baelmans, M., “Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications”, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 1422-1429. [PDF]
Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels. Fluids, 4(3), 145. DOI: 10.3390/fluids4030145 [PDF]
Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Low-cost Energy Efficient On-chip Hotspot Targeted Microjet Cooling for High Power Electronics. IEEE Transactions on Components, Packaging and Manufacturing Technology. vol. 10, no. 4, pp. 577-589, April 2020. DOI: 10.1109/TCPMT.2019.2948522 [PDF]