Advanced liquid cooling solutions are needed to address the thermal challenges of next-generation high-power density 3D integration systems. Impingement jet cooling shows great potential for hotspot-targeted cooling. In the case of hotspot power dissipation patterns, the location of the impinging jet nozzles ejecting the coolant onto the chip can be aligned to the hotspot locations. However, the current state-of-art hotspot-targeted cooling solutions could not handle the dynamically changed power dissipations.