Anaheim, CA — At the ASME Electronic and Photonic Packaging Division’s InterPACK 2025 conference, Prof. Tiwei Wei received the prestigious EPPD Early Career Engineer Award in recognition of his contributions to electronic and photonic packaging. Prof. Wei expressed gratitude to mentors, collaborators, and students for their continuous support, noting that the honor further motivates his […]
We thank you for registering for our tutorial, “Thermal Challenges for Heterogeneous Integration Packaging”. It included these two talks: “Cooler Material Reliability Considerations for Bare Die Impingement Cooling in Package” (24:41), Prof. Tiwei Wei, ME Department, Purdue University; and “Development of a High Heat Flux and Ultra-low Thermal Resistance Microcooler” (32:58), Dr. Mehdi Asheghi, ME […]
Our lab has 4 SCALE SURF positions for this summer, with topics of advanced packaging and heterogeneous integration. Those projects are from SCALE SURF research projects. SCALE projects are restricted to students who are U.S. Citizens. By applying to this project, you can be considered for any of the SCALE projects with one application. See https://lnkd.in/gfMaX6cT to […]
On December 09, 2022, Prof. Wei received a surprise “Thanks” cake from ME 315 class students. What a great coincidence that it happened to be Dr. Wei’s Chinese lunar birthday as well.
Professor Wei, dropped by Stanford to visit Nanoheat group. Nanoheaters, of course, had to invite him to his favorite meal while he was in the area: hotpot. https://nanoheat.stanford.edu/group/2022/prof-wei-visits-nanoheat/
Alpha Lab participated the Thursday’s Women in Mechanical Engineering Symposium on November 3rd, 2022.