Author: Tiwei Wei

Tiwei Wei receives the 2026 IEEE EPS – IEEE Electronics Packaging Society “Exceptional Technical Achievement Award”

Tiwei Wei, Assistant Professor of Mechanical and Aerospace Engineering at the UCLA Samueli School of Engineering, has been selected as the recipient of the 2026 IEEE Electronics Packaging Society (EPS) Exceptional Technical Achievement Award. He is being recognized for his pioneering contributions to thermal management technologies for 2.5D and 3D system integration, including advances in […]

Celebrating Our First PhD Graduate: Shuhang Lyu

We are proud to share a historic milestone for our group! Our very first PhD student, Dr. Shuhang Lyu, co-advised with Prof. Thomas Beechem, has successfully passed his final PhD defense. His dissertation, “Understanding Thermomechanical Response of Scaled Through Silicon Vias for High-Density 3D Packaging,” provides important insights into reliability challenges in next-generation microelectronic systems. […]

Prof. Tiwei Wei and Graduate Student Ye Yang Honored at ASME InterPACK 2025

Anaheim, CA — At the ASME Electronic and Photonic Packaging Division’s InterPACK 2025 conference, Prof. Tiwei Wei received the prestigious EPPD Early Career Engineer Award in recognition of his contributions to electronic and photonic packaging. Prof. Wei expressed gratitude to mentors, collaborators, and students for their continuous support, noting that the honor further motivates his […]

Prof. Wei delivered Tutorial for IEEE REPP: Thermal Challenges For Heterogeneous Integration Packaging

We thank you for registering for our tutorial, “Thermal Challenges for Heterogeneous Integration Packaging”.  It included these two talks: “Cooler Material Reliability Considerations for Bare Die Impingement Cooling in Package” (24:41), Prof. Tiwei Wei, ME Department, Purdue University; and “Development of a High Heat Flux and Ultra-low Thermal Resistance Microcooler” (32:58), Dr. Mehdi Asheghi, ME […]