We are delighted to share that Dr. Zhengwei Chen has successfully passed his PhD public defense. He has been co-advised by Prof. Tiwei Wei and Prof. Amy Marconnet throughout his doctoral studies. Dr. Chen’s research has advanced the field of thermal management for next-generation heterogeneous integration and 3D packaging systems, addressing key challenges in heat […]
We are proud to share a historic milestone for our group! Our very first PhD student, Dr. Shuhang Lyu, co-advised with Prof. Thomas Beechem, has successfully passed his final PhD defense. His dissertation, “Understanding Thermomechanical Response of Scaled Through Silicon Vias for High-Density 3D Packaging,” provides important insights into reliability challenges in next-generation microelectronic systems. […]
Anaheim, CA — At the ASME Electronic and Photonic Packaging Division’s InterPACK 2025 conference, Prof. Tiwei Wei received the prestigious EPPD Early Career Engineer Award in recognition of his contributions to electronic and photonic packaging. Prof. Wei expressed gratitude to mentors, collaborators, and students for their continuous support, noting that the honor further motivates his […]
We thank you for registering for our tutorial, “Thermal Challenges for Heterogeneous Integration Packaging”. It included these two talks: “Cooler Material Reliability Considerations for Bare Die Impingement Cooling in Package” (24:41), Prof. Tiwei Wei, ME Department, Purdue University; and “Development of a High Heat Flux and Ultra-low Thermal Resistance Microcooler” (32:58), Dr. Mehdi Asheghi, ME […]
On December 09, 2022, Prof. Wei received a surprise “Thanks” cake from ME 315 class students. What a great coincidence that it happened to be Dr. Wei’s Chinese lunar birthday as well.