Prof. Wei and Shuhang attended IEEE ITherm and ECTC 2023!
Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2023 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. At this year’s event, Purdue faculty were very involved in the conference organization: Amy Marconnet was the vice program chair for the conference, and Justin Weibel (a past general chair) was also involved in organizing the conference keynotes. Neera Jain and Tiwei Wei served as session chairs. https://engineering.purdue.edu/ME/News/2023/purdue-excels-at-itherm-conference