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Current Research

Grain-Structure Engineering for Thermal Transport and Stress Control in 3D Interconnects

Grain-Structure Engineering for Thermal Transport and Stress Control in 3D Interconnects

Interfacial Diffusion in Scaled Cu/Sn Microbump Bonding

Interfacial Diffusion in Scaled Cu/Sn Microbump Bonding

Bonding Mechanisms and Interfacial Stress in Cu–Cu Direct Bonding

Bonding Mechanisms and Interfacial Stress in Cu–Cu Direct Bonding

Fundamental Thermomechanical Behavior of Scaled Through-Silicon Vias

Fundamental Thermomechanical Behavior of Scaled Through-Silicon Vias

High-Thermal-Conductivity Materials for 3D Semiconductor Integration

High-Thermal-Conductivity Materials for 3D Semiconductor Integration

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Featured Publications

Wei, T. W., Lin, Z., Asheghi, M., & Goodson, K. E*., Micro-channel Cooling Technique to Minimize Thermal Deformation of the X-ray and High-power Laser Optics, International Conference on Synchrotron Radiation Instrumentation (SRI) 2022.

Wei, T. W.*, Hazra, S., Asheghi, M., & Goodson, K. E. Numerical Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3D Manifold Coolers. Journal of Electronic Packaging 2022.

Wei, T. W.*, Oprins, H., et al., Heat Transfer and Friction Factor Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets, Int. J. Heat Mass Transf, 2021, Volume 182, 121865.

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Media

Featured News

Tiwei Wei Presents Advanced Thermal Management of 3D Semiconductor Chips and Packages at CA DREAMS – Technical Seminar Series

Professor Tiwei Wei presented a technical seminar, “Advanced Thermal Management of 3D Semiconductor Chips and Packages: From External Cooling to High-Performance Thermal Materials Within the Package,” as part of the CA DREAMS Technical Seminar Series at the USC Information Sciences Institute. As semiconductor systems continue to evolve toward high-density 2.5D and 3D heterogeneous integration, increasing […]

Tiwei Wei receives the 2026 IEEE EPS – IEEE Electronics Packaging Society “Exceptional Technical Achievement Award”

Tiwei Wei, Assistant Professor of Mechanical and Aerospace Engineering at the UCLA Samueli School of Engineering, has been selected as the recipient of the 2026 IEEE Electronics Packaging Society (EPS) Exceptional Technical Achievement Award. He is being recognized for his pioneering contributions to thermal management technologies for 2.5D and 3D system integration, including advances in […]

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