Electronics Cooling and Thermal Management

Xie, F.F., Chen R.M., and Wei, T.W.*, Thermal Mitigation Strategy for Backside Power Delivery Network, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 1485-1492.

Xie, F.F., Chen R.M., and Wei, T.W.*, Thermal Mitigation Strategy for Backside Power Delivery Network, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 1485-1492. DOI: 10.1109/ECTC51529.2024.00241 [PDF]

Lyu, Shuhang, Qianying Wu, and Tiwei Wei. “Hotspot-targeted Cooling Scheme with Hybrid Jet Impingement/Thermal Through Silicon Via (TSV).” 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2023.

Lyu, Shuhang, Qianying Wu, and Tiwei Wei. “Hotspot-targeted Cooling Scheme with Hybrid Jet Impingement/Thermal Through Silicon Via (TSV).” 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2023. DOI:10.1109/ITherm55368.2023.10177590 [PDF]

Lin, Yujui*, Tiwei Wei*, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, and Kenneth Goodson. “Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module.” Journal of Electronic Packaging (2023): 1-45.

Lin, Yujui*, Tiwei Wei*, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, and Kenneth Goodson. “Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module.” Journal of Electronic Packaging (2023): 1-45.

Oprins H, Wei T, Cherman V, et al. Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD–FEM modeling study[C]//2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2023: 1-10.

H Oprins, Tiwei Wei, Vladimir Cherman, E Beyne (2023, May). Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD–FEM modeling study. In 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1-10). IEEE.

Chen H, Wei, T. W., et al. Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler[C]//2022 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE, 2022: 962-965.

Chen H, Wei, T. W., et al. Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler[C]//2022 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE, 2022: 962-965. DOI: 10.1109/APEC43599.2022.9773698 [PDF]