Electronics Cooling and Thermal Management

Lyu, Shuhang, Qianying Wu, and Tiwei Wei. “Hotspot-targeted Cooling Scheme with Hybrid Jet Impingement/Thermal Through Silicon Via (TSV).” 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2023.

Lyu, Shuhang, Qianying Wu, and Tiwei Wei. “Hotspot-targeted Cooling Scheme with Hybrid Jet Impingement/Thermal Through Silicon Via (TSV).” 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2023. DOI:10.1109/ITherm55368.2023.10177590 [PDF]

Lin, Yujui*, Tiwei Wei*, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, and Kenneth Goodson. “Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module.” Journal of Electronic Packaging (2023): 1-45.

Lin, Yujui*, Tiwei Wei*, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, and Kenneth Goodson. “Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module.” Journal of Electronic Packaging (2023): 1-45.

Oprins H, Wei T, Cherman V, et al. Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD–FEM modeling study[C]//2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2023: 1-10.

H Oprins, Tiwei Wei, Vladimir Cherman, E Beyne (2023, May). Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD–FEM modeling study. In 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1-10). IEEE.

Chen H, Wei, T. W., et al. Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler[C]//2022 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE, 2022: 962-965.

Chen H, Wei, T. W., et al. Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler[C]//2022 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE, 2022: 962-965. DOI: 10.1109/APEC43599.2022.9773698 [PDF]

Hazra, S.*, Wei, T. W., Lin, Y., Asheghi, M, Goodson, K., Gupta M. P., Degner M., Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling, International Journal of Heat and Mass Transfer, 2022, 197, 123356.

Hazra, S.*, Wei, T. W., Lin, Y., Asheghi, M, Goodson, K., Gupta M. P., Degner M., Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling, International Journal of Heat and Mass Transfer, 2022, 197, 123356. [PDF]

Wei, T. W.*, Oprins, H., et al., Experimental and Numerical Study of 3D Printed Direct Jet Impingement Cooling for High Power, Large Die Size Applications, in IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, doi: 10.1109/TCPMT.2020.3045113.

Wei, T. W.*, Oprins, H., et al., Experimental and Numerical Study of 3D Printed Direct Jet Impingement Cooling for High Power, Large Die Size Applications, in IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020. DOI: 10.1109/TCPMT.2020.3045113 [PDF]

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2020). Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5 D integrated systems. Applied Thermal Engineering, 2020, 164, 114535.

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2020). Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5 D integrated systems. Applied Thermal Engineering, 2020, 164, 114535. DOI: 10.1016/j.applthermaleng.2019.114535 [PDF]

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Low-cost Energy Efficient On-chip Hotspot Targeted Microjet Cooling for High Power Electronics. IEEE Transactions on Components, Packaging and Manufacturing Technology. vol. 10, no. 4, pp. 577-589, April 2020.

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Low-cost Energy Efficient On-chip Hotspot Targeted Microjet Cooling for High Power Electronics. IEEE Transactions on Components, Packaging and Manufacturing Technology. vol. 10, no. 4, pp. 577-589, April 2020. DOI: 10.1109/TCPMT.2019.2948522 [PDF]