Sahu, G., Li, R., Yogi, K., Patel, A., & Wei, T.W.*. Experimental Investigation of a Compact Lid-Compatible Multi-jet Impingement Manifold for Direct-On-Chip Cooling. IEEE Transactions on Components, Packaging and Manufacturing Technology, 1109/TCPMT.2024.3506943
Xie, F., & Wei, T.W.*, (2025). Exploring Efficient Thermal Management Solutions for Backside Power Delivery Network (BSPDN) Systems Using Multi-Scale Modeling. IEEE Transactions on Components, Packaging and Manufacturing Technology, March 2025. 1109/TCPMT.2025.3551225
Yang, Y., Lahaie, K. E., & Wei, T.W.*, (2025). Double-Sided Copper Filling of Small diameter, High-Aspect Ratio Through-Glass Vias in High-Density Glass Interposers. IEEE Transactions on Components, Packaging and Manufacturing Technology. 1109/TCPMT.2025.3557232
Patel, A., Yogi, K., Sahu, G., & Wei, T.W.*, (2025). Multi-chip Jet impingement cooling for heat dissipation in 2.5 D integrated system with 1 kW+ thermal design power. International Journal of Heat and Mass Transfer, 244, p.126978. https://doi.org/10.1016/j.ijheatmasstransfer.2025.126978
Sahu, G., Rajeev, S., Hoang, D., Lattupalli, H. K., Rangarajan, S., Sammakia, B. G., & Wei, T. (2025). Integrated Metal-Lidded Microfluidic Cooling on a High-Power AI Chip Using Confined Two-Phase Liquid Jet with Dielectric Fluid R1233zd (E). IEEE Transactions on Components, Packaging and Manufacturing Technology. 1109/TCPMT.2025.3623470
Chen, Z., Song, Y., Yang, Y., Quan, I. X., Marconnet, A. M., & Wei, T. (2026). Experimental Investigation of In-Plane Thermal Isolation Strategies for 2.5 D Silicon-Based Integration Systems. Journal of Electronic Packaging, 148(2), 020901. https://doi.org/10.1115/1.4071318
Yogi, K., Sahu, G., Rajeev, S., Lattupalli, H. K., Wang, K., Chen, Z., … & Wei, T. (2026). Experimental Characterization and Server-Level Demonstration of Confined, Direct-on-Silicon Two-Phase Jet-Impingement Cooling With Additively Manufactured Porous-Wick-Assisted Phase Separation. Journal of Electronic Packaging, 148(2), 020904. https://doi.org/10.1115/1.4071262
L.Q. Wang , F.F. Xie(Co-first author), J.Z Liu, L.M. Peng, Z.Y Zhang, T.W. Wei*, R.M. Chen, IEEE International Electron Devices Meeting (IEDM) 2024. [PDF]
Wei, T., Design Considerations for Chip/Package Level BareDie Impingement Cooling for High PerformanceComputation Systems, Electronics Cooling, 2024. [PDF]
Patel, A., Yogi, K., Sahu G., Wei, T., A Novel Multi-chip Jet Impingement Cooler for Direct-on-chip Cooling of High Performance Interposer Package, 3DIC 2024. [PDF]