Chen H, Wei, T. W., et al. Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler[C]//2022 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE, 2022: 962-965. DOI: 10.1109/APEC43599.2022.9773698 [PDF]
Chen H, Wei, T. W., et al. Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler[C]//2022 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE, 2022: 962-965.