Lyu, S.H., Wu, Q.Y., Goodson, K. E. & Wei, T.W.*, Thermomechanical Modeling and Stress Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling, IEEE CPMT, 2023. DOI: 10.1109/TCPMT.2024.3391231
Lyu, S.H., Wu, Q.Y., Goodson, K. E. & Wei, T.W.*, Thermomechanical Modeling and Stress Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling, IEEE CPMT, 2023.