Lin, Yujui*, Tiwei Wei*, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, and Kenneth Goodson. “Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module.” Journal of Electronic Packaging (2023): 1-45.
Lin, Yujui*, Tiwei Wei*, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, and Kenneth Goodson. “Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module.” Journal of Electronic Packaging (2023): 1-45.