Prof. Wei will work with Prof. Dan Jiao and other colleagues on a new NSF funded grant “FuSe-TG: Open, Multiscale, Application-Agnostic Platform for Heterogeneous System-in-Package Co-Design”
Prof. Wei was elected as Technical Program Chair for the 2023 IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP).
Alpha Lab receives 3-year funding from Semiconductor Research Corporation – SRC, for the 3D interconnects processing and thermomechanical characterization, collaboration with Prof. Thomas Beechem. The project will start from January 2023.
Shuhang Lyu received “Best Student Presentation Award” in 2022 IEEE REPP for his great work on “Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling” [Video].
Alpha Lab presented our recent research results in IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP) on 9-10 November 2022 at Texas Instruments, Santa Clara, CA USA. Shuhang Lyu presented his recent work on “Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling”[Video]. Zheng Gong presented his work with the title “Thermomechanical […]
Prof. Tiwei Wei, Prof. Xiulin Ruan and Prof. Amy Marconnet received funding from Cooling Technologies Research Center (CTRC), with the development of Metamaterials for Package-Level Heat Flow Control. The project will start from January 2023.
In 2022/12/07, Prof. Wei received invitation from Nature to be as a reviewer in the field of electronic cooling. He has been acted as a Reviewer for Nature (2020), Nature (2022). In 2021, Prof. Wei was invited to write a Nature News and Views paper, published in Nature.