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University of California, Los Angeles

Thermal Science Laboratory for Semiconductor Packaging & Integration

UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration
Assistant Professor, Mechanical and Aerospace Engineering
Associate Director, UCLA CHIPS
University of California, Los Angeles
420 Westwood Plaza, 37-144 Engineering IV Bldg
Phone: 650-505-6084, Email: tiwei32@ucla.edu
Research Group: https://s-pack.org/

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