Alpha Lab presented our recent research results in IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP) on 9-10 November 2022 at Texas Instruments, Santa Clara, CA USA. Shuhang Lyu presented his recent work on “Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling”[Video]. Zheng Gong presented his work with the title “Thermomechanical Modeling and Reliability Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling”[Video]. Great work!
