Conference Proceedings

Wei, T. W.*, Oprins, H., Beyne, E., & Baelmans, M. (2019, May). First Demonstration of a Low Cost/Customizable Chip Level 3D Printed Microjet Hotspot-Targeted Cooler for High Power Applications. In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (pp. 126-134). IEEE.

Wei, T. W.*, Oprins, H., Beyne, E., & Baelmans, M. (2019, May). First Demonstration of a Low Cost/Customizable Chip Level 3D Printed Microjet Hotspot-Targeted Cooler for High Power Applications. In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (pp. 126-134). IEEE. [PDF]

Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., Yang, S., & Baelmans, M. (2018, May). 3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (pp. 2389-2396). IEEE.

Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., Yang, S., & Baelmans, M. (2018, May). 3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (pp. 2389-2396). IEEE. [PDF]

Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., & Baelmans, T. (2018). Nozzle array scaling analysis of the thermal performance of liquid jet impingement coolers for high performance electronic applications. In The 16th International Heat Transfer Conference. The Assembly for International Heat Transfer Conferences; Beijing, China.

Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., & Baelmans, T. (2018). Nozzle array scaling analysis of the thermal performance of liquid jet impingement coolers for high performance electronic applications. In The 16th International Heat Transfer Conference. The Assembly for International Heat Transfer Conferences; Beijing, China.

Wei, T. W.*, Oprins, H., Cherman, V., Van der Plas, G., De Wolf, I., Beyne, E., & Baelmans, M. (2017, December). High efficiency direct liquid jet impingement cooling of high-power devices using a 3D-shaped polymer cooler. In 2017 IEEE International Electron Devices Meeting (IEDM) (pp. 32-5). IEEE.

Wei, T. W.*, Oprins, H., Cherman, V., Van der Plas, G., De Wolf, I., Beyne, E., & Baelmans, M. (2017, December). High efficiency direct liquid jet impingement cooling of high-power devices using a 3D-shaped polymer cooler. In 2017 IEEE International Electron Devices Meeting (IEDM) (pp. 32-5). IEEE. [PDF]

Wei, T. W., Wang, Q., Liu, Z., Li, Y., Wang, D., Wang, T., & Cai, J*. (2012, December). A 3D integration testing vehicle with TSV interconnects. In 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (pp. 1-5). IEEE.

Wei, T. W., Wang, Q., Liu, Z., Li, Y., Wang, D., Wang, T., & Cai, J*. (2012, December). A 3D integration testing vehicle with TSV interconnects. In 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (pp. 1-5). IEEE. [PDF]

Wei, T. W., Cai J.*, Wang Q., et al. Copper filling process for small diameter, high aspect ratio through silicon via (TSV)[C]//2012 13th International Conference on Electronic Packaging Technology & High Density Packaging. IEEE, 2012: 483-487. (Outstanding Paper Award)

Wei, T. W., Cai J.*, Wang Q., et al. Copper filling process for small diameter, high aspect ratio through silicon via (TSV)[C]//2012 13th International Conference on Electronic Packaging Technology & High Density Packaging. IEEE, 2012: 483-487. (Outstanding Paper Award) [PDF]