Conference Proceedings

Zheng, G., Wu, Q. Y., Wei, T. W.*, “Thermomechanical Modeling and Reliability Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling,” 2022 IEEE Symposium on Reliability for Electronics & Photonics Packaging (REPP), 2022. [Video]

Zheng, G., Wu, Q. Y., Wei, T. W.*, “Thermomechanical Modeling and Reliability Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling,” 2022 IEEE Symposium on Reliability for Electronics & Photonics Packaging (REPP), 2022. [Video] [PDF]

Lyu, S. H., Wu, Q. Y., Wei, T. W.*, “Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling,” 2022 IEEE Symposium on Reliability for Electronics & Photonics Packaging (REPP), 2022. [Video]

Lyu, S. H., Wu, Q. Y., Wei, T. W.*, “Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling,” 2022 IEEE Symposium on Reliability for Electronics & Photonics Packaging (REPP), 2022. [PDF] [Video]

Wei, T. W., Chen H., Lin Y., Hazra S., Chen Y., G. Prakash, N. Li, Y. Lu, H. A. Mantooth, Asheghi, M., Goodson K. E., “Demonstration and Experimental Characterization of DBC Active Laser-cut Microchannel Cooling with 3D Manifold,” 21th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2022.

Wei, T. W., Chen H., Lin Y., Hazra S., Chen Y., G. Prakash, N. Li, Y. Lu, H. A. Mantooth, Asheghi, M., Goodson K. E., “Demonstration and Experimental Characterization of DBC Active Laser-cut Microchannel Cooling with 3D Manifold,” 21th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2022.

Wei, T. W., Lin, Z., Asheghi, M., & Goodson, K. E*., “Micro-channel Cooling Technique to Minimize Thermal Deformation of the X-ray and High-power Laser Optics”, International Conference on Synchrotron Radiation Instrumentation (SRI) 2022.

Wei, T. W., Lin, Z., Asheghi, M., & Goodson, K. E*., “Micro-channel Cooling Technique to Minimize Thermal Deformation of the X-ray and High-power Laser Optics”, International Conference on Synchrotron Radiation Instrumentation (SRI) 2022.

H. Chen, Wei, T. W., Y. Chen, X. Li, N. Li, Q. Zhu, S. Hazra, Y. Zhao, M. P. Gupta, M. Asheghi, Y. Lu, K. Goodson, H. A. Mantooth, “Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler” 2022 IEEE Applied Power Electronics Conference and Exposition.

H. Chen, Wei, T. W., Y. Chen, X. Li, N. Li, Q. Zhu, S. Hazra, Y. Zhao, M. P. Gupta, M. Asheghi, Y. Lu, K. Goodson, H. A. Mantooth, “Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler” 2022 IEEE Applied Power Electronics Conference and Exposition. [PDF]

Chen, H., Wei, T. W., Li, X., Chen, Y., Lin, Y., Chinnaiyan, S., Asheghi, M., Mantooth, H. A., Demonstration of Wire bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler, 2022 IEEE Energy Conversion Congress and Exposition

Chen, H., Wei, T. W., Li, X., Chen, Y., Lin, Y., Chinnaiyan, S., Asheghi, M., Mantooth, H. A., Demonstration of Wire bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler, 2022 IEEE Energy Conversion Congress and Exposition [PDF]

Wei, T. W., Jung, K. W., Piazza, A., Hazra, S., Iyengar, M., Malone, C., Asheghi, M., & Goodson, K. E*. Parametric CFD Study of Large Footprint (24 x 24 mm2) Silicon-based Embedded Microchannel-3D Manifold Coolers. InterPACK 2020. (presentation only)

Wei, T. W., Jung, K. W., Piazza, A., Hazra, S., Iyengar, M., Malone, C., Asheghi, M., & Goodson, K. E*. Parametric CFD Study of Large Footprint (24 x 24 mm2) Silicon-based Embedded Microchannel-3D Manifold Coolers. InterPACK 2020. (presentation only)

Wei, T. W.*, Oprins, H., Cherman, V., Yang, Z., Rivera, K., Van der Plas, G., Pawlak, B. J., England, L., Beyne, E., & Baelmans, M., “Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications”, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 1422-1429.

Wei, T. W.*, Oprins, H., Cherman, V., Yang, Z., Rivera, K., Van der Plas, G., Pawlak, B. J., England, L., Beyne, E., & Baelmans, M., “Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications”, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. […]

Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Van der Plas, G., Beyne, E., & Baelmans, M. (2019, May). Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5 D Si Interposer Packages. In 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1243-1252). IEEE.

Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Van der Plas, G., Beyne, E., & Baelmans, M. (2019, May). Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5 D Si Interposer Packages. In 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1243-1252). […]