Wei, T. W., Qiu X., Lo J C C, Ricky L.*. Wafer level bumping technology for high voltage LED packaging[C]//2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2015: 54-57. [PDF]
Wei, T. W., Qiu X., Lo J C C, Ricky L.*. Wafer level bumping technology for high voltage LED packaging[C]//2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2015: 54-57.