Conference Proceedings – S-PACK Lab (Semiconductor Packaging Laboratory)

Wei, T.W., Lin Zhang, Mehdi Asheghi, Kenneth E. Goodson, Embedded Microchannel Cryogenic Cooling for Silicon Crystal Monochromators using Liquid Nitrogen and Liquid Argon, Itherm 2024.

Wei, T.W., Lin Zhang, Mehdi Asheghi, Kenneth E. Goodson, Embedded Microchannel Cryogenic Cooling for Silicon Crystal Monochromators using Liquid Nitrogen and Liquid Argon, Itherm 2024. [PDF]

Feifan Xie, Shuhang Lyu, Zhi Yang, Wei, T.W., Direct-On-Chip Hotspot Targeted Microjet Cooling for Ultra-fast Inference at Scale Running on Groq Language Processing Unit (LPU™), Itherm 2024.

Feifan Xie, Shuhang Lyu, Zhi Yang, Wei, T.W., Direct-On-Chip Hotspot Targeted Microjet Cooling for Ultra-fast Inference at Scale Running on Groq Language Processing Unit (LPU™), Itherm 2024. [PDF]

Feifan Xie, Shuhang Lyu, Wei, T.W., Thermal Analysis of Dual-sided Cooling for Backside Power Delivery Networks (BSPDN) on 2.5D Glass/Silicon Interposer Package, Itherm 2024.

Feifan Xie, Shuhang Lyu, Wei, T.W., Thermal Analysis of Dual-sided Cooling for Backside Power Delivery Networks (BSPDN) on 2.5D Glass/Silicon Interposer Package, Itherm 2024. [PDF]

Akshat Patel, Gopinath Sahu, Wei, T.W., Heat Transfer Enhancement for Direct-on-Chip Impingement Jet Cooling using Variable Micro Pin Fins and Tapered Impingement Cavity, Itherm 2024.

Akshat Patel, Gopinath Sahu, Wei, T.W., Heat Transfer Enhancement for Direct-on-Chip Impingement Jet Cooling using Variable Micro Pin Fins and Tapered Impingement Cavity, Itherm 2024. [PDF]

Xie, F.F., Chen R.M., and Wei, T.W.*, Thermal Mitigation Strategy for Backside Power Delivery Network, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 1485-1492.

Xie, F.F., Chen R.M., and Wei, T.W.*, Thermal Mitigation Strategy for Backside Power Delivery Network, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 1485-1492. DOI: 10.1109/ECTC51529.2024.00241 [PDF]

Lyu, S.H., Thomas B., and Wei, T.W.*, Thermo-Mechanical Reliability Analysis and Raman Spectroscopy Characterization of Sub-micron Through Silicon Vias (TSVs) for Backside Power Delivery in 3D Interconnects, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 834-841.

Lyu, S.H., Thomas B., and Wei, T.W.*, Thermo-Mechanical Reliability Analysis and Raman Spectroscopy Characterization of Sub-micron Through Silicon Vias (TSVs) for Backside Power Delivery in 3D Interconnects, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 834-841. DOI: 10.1109/ECTC51529.2024.00134 [PDF]

Wang, K.Y, Lyu, S.H., and Wei, T.W.*, A Novel Copper Microporous-Assisted Bonding Method for Fine-Pitch Cu/Sn Microbump 3D Interconnects, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 563-570. IEEE, 2024.

Wang, K.Y, Lyu, S.H., and Wei, T.W.*, A Novel Copper Microporous-Assisted Bonding Method for Fine-Pitch Cu/Sn Microbump 3D Interconnects, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 563-570. IEEE, 2024. DOI: 10.1109/ECTC51529.2024.00095 [PDF]

Lyu, Shuhang, Qianying Wu, and Tiwei Wei. “Hotspot-targeted Cooling Scheme with Hybrid Jet Impingement/Thermal Through Silicon Via (TSV).” 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2023.

Lyu, Shuhang, Qianying Wu, and Tiwei Wei. “Hotspot-targeted Cooling Scheme with Hybrid Jet Impingement/Thermal Through Silicon Via (TSV).” 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2023. DOI:10.1109/ITherm55368.2023.10177590 [PDF]

Lin, Y., Wei, T. W., Asheghi, M., Goodson, K. E.*, The Capillary-driven Two-phase Embedded Microchannel Heatsink for the Efficient Cooling of Power Electronic Modules, Bulletin of the American Physical Society, 2023

Lin, Y., Wei, T. W., Asheghi, M., Goodson, K. E.*, The Capillary-driven Two-phase Embedded Microchannel Heatsink for the Efficient Cooling of Power Electronic Modules, Bulletin of the American Physical Society, 2023

Wei, T. W., Lin, Z., Asheghi, M., & Goodson, K. E*., Micro-channel Cooling Technique to Minimize Thermal Deformation of the X-ray and High-power Laser Optics, International Conference on Synchrotron Radiation Instrumentation (SRI) 2022.

Wei, T. W., Lin, Z., Asheghi, M., & Goodson, K. E*., Micro-channel Cooling Technique to Minimize Thermal Deformation of the X-ray and High-power Laser Optics, International Conference on Synchrotron Radiation Instrumentation (SRI) 2022.