Wang, K.Y, Lyu, S.H., and Wei, T.W.*, A Novel Copper Microporous-Assisted Bonding Method for Fine-Pitch Cu/Sn Microbump 3D Interconnects, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 563-570. IEEE, 2024. DOI: 10.1109/ECTC51529.2024.00095 [PDF]

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