Conference Proceedings – Page 3 – S-PACK Lab (Semiconductor Packaging Laboratory)

Wei, T. W.*, Oprins, H., Cherman, V., Yang, Z., Rivera, K., Van der Plas, G., Pawlak, B. J., England, L., Beyne, E., & Baelmans, M., “Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications”, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 1422-1429.

Wei, T. W.*, Oprins, H., Cherman, V., Yang, Z., Rivera, K., Van der Plas, G., Pawlak, B. J., England, L., Beyne, E., & Baelmans, M., “Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications”, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. […]

Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Van der Plas, G., Beyne, E., & Baelmans, M. (2019, May). Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5 D Si Interposer Packages. In 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1243-1252). IEEE.

Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Van der Plas, G., Beyne, E., & Baelmans, M. (2019, May). Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5 D Si Interposer Packages. In 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1243-1252). […]

Wei, T. W.*, Oprins, H., Beyne, E., & Baelmans, M. (2019, May). First Demonstration of a Low Cost/Customizable Chip Level 3D Printed Microjet Hotspot-Targeted Cooler for High Power Applications. In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (pp. 126-134). IEEE.

Wei, T. W.*, Oprins, H., Beyne, E., & Baelmans, M. (2019, May). First Demonstration of a Low Cost/Customizable Chip Level 3D Printed Microjet Hotspot-Targeted Cooler for High Power Applications. In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (pp. 126-134). IEEE. [PDF]

Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., Yang, S., & Baelmans, M. (2018, May). 3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (pp. 2389-2396). IEEE.

Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., Yang, S., & Baelmans, M. (2018, May). 3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (pp. 2389-2396). IEEE. [PDF]

Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., & Baelmans, T. (2018). Nozzle array scaling analysis of the thermal performance of liquid jet impingement coolers for high performance electronic applications. In The 16th International Heat Transfer Conference. The Assembly for International Heat Transfer Conferences; Beijing, China.

Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., & Baelmans, T. (2018). Nozzle array scaling analysis of the thermal performance of liquid jet impingement coolers for high performance electronic applications. In The 16th International Heat Transfer Conference. The Assembly for International Heat Transfer Conferences; Beijing, China.

Wei, T. W.*, Oprins, H., Cherman, V., Van der Plas, G., De Wolf, I., Beyne, E., & Baelmans, M. (2017, December). High efficiency direct liquid jet impingement cooling of high-power devices using a 3D-shaped polymer cooler. In 2017 IEEE International Electron Devices Meeting (IEDM) (pp. 32-5). IEEE.

Wei, T. W.*, Oprins, H., Cherman, V., Van der Plas, G., De Wolf, I., Beyne, E., & Baelmans, M. (2017, December). High efficiency direct liquid jet impingement cooling of high-power devices using a 3D-shaped polymer cooler. In 2017 IEEE International Electron Devices Meeting (IEDM) (pp. 32-5). IEEE. [PDF]

Wei, T. W., Qiu X., Lo J C C, Ricky L.*. Wafer level bumping technology for high voltage LED packaging[C]//2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2015: 54-57.

Wei, T. W., Qiu X., Lo J C C, Ricky L.*. Wafer level bumping technology for high voltage LED packaging[C]//2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2015: 54-57. [PDF]

Wei, T. W., Cai J.*, et al. Performance and reliability study of TGV interposer in 3D integration[C]//2014 IEEE 16th Electronics Packaging Technology Conference (EPTC). IEEE, 2014: pp. 601-605.

Wei, T. W., Cai J.*, et al. Performance and reliability study of TGV interposer in 3D integration[C]//2014 IEEE 16th Electronics Packaging Technology Conference (EPTC). IEEE, 2014: pp. 601-605. [PDF]

Wei, T. W., Wang, Q., Liu, Z., Li, Y., Wang, D., Wang, T., & Cai, J*. (2012, December). A 3D integration testing vehicle with TSV interconnects. In 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (pp. 1-5). IEEE.

Wei, T. W., Wang, Q., Liu, Z., Li, Y., Wang, D., Wang, T., & Cai, J*. (2012, December). A 3D integration testing vehicle with TSV interconnects. In 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (pp. 1-5). IEEE. [PDF]

Wei, T. W., Cai J.*, Wang Q., et al. Copper filling process for small diameter, high aspect ratio through silicon via (TSV)[C]//2012 13th International Conference on Electronic Packaging Technology & High Density Packaging. IEEE, 2012: 483-487. (Outstanding Paper Award)

Wei, T. W., Cai J.*, Wang Q., et al. Copper filling process for small diameter, high aspect ratio through silicon via (TSV)[C]//2012 13th International Conference on Electronic Packaging Technology & High Density Packaging. IEEE, 2012: 483-487. (Outstanding Paper Award) [PDF]