Wei, T. W., Wang, Q., Liu, Z., Li, Y., Wang, D., Wang, T., & Cai, J*. (2012, December). A 3D integration testing vehicle with TSV interconnects. In 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (pp. 1-5). IEEE. [PDF]
Wei, T. W., Wang, Q., Liu, Z., Li, Y., Wang, D., Wang, T., & Cai, J*. (2012, December). A 3D integration testing vehicle with TSV interconnects. In 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (pp. 1-5). IEEE.