Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., Yang, S., & Baelmans, M. (2018, May). 3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (pp. 2389-2396). IEEE. [PDF]
Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., Yang, S., & Baelmans, M. (2018, May). 3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (pp. 2389-2396). IEEE.