Microelectronics Packaging and Manufacturing – S-PACK Lab (Semiconductor Packaging Laboratory)

Lyu, S.H., Thomas B., and Wei, T.W.*, Thermo-Mechanical Reliability Analysis and Raman Spectroscopy Characterization of Sub-micron Through Silicon Vias (TSVs) for Backside Power Delivery in 3D Interconnects, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 834-841.

Lyu, S.H., Thomas B., and Wei, T.W.*, Thermo-Mechanical Reliability Analysis and Raman Spectroscopy Characterization of Sub-micron Through Silicon Vias (TSVs) for Backside Power Delivery in 3D Interconnects, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 834-841. DOI: 10.1109/ECTC51529.2024.00134 [PDF]

Wang, K.Y, Lyu, S.H., and Wei, T.W.*, A Novel Copper Microporous-Assisted Bonding Method for Fine-Pitch Cu/Sn Microbump 3D Interconnects, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 563-570. IEEE, 2024.

Wang, K.Y, Lyu, S.H., and Wei, T.W.*, A Novel Copper Microporous-Assisted Bonding Method for Fine-Pitch Cu/Sn Microbump 3D Interconnects, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 563-570. IEEE, 2024. DOI: 10.1109/ECTC51529.2024.00095 [PDF]

Wei, T. W., C. Jian*, et al., Optimization and Evaluation of Sputtering Barrier/seed layer In Through Silicon Via for 3-D integration [J], Tsinghua Science and Technology, 2014, 19(2): 150-160.

Wei, T. W., C. Jian*, et al., Optimization and Evaluation of Sputtering Barrier/seed layer In Through Silicon Via for 3-D integration [J], Tsinghua Science and Technology, 2014, 19(2): 150-160. DOI: 10.1109/TST.2014.6787368 [PDF]