Wei, T. W., C. Jian*, et al., Optimization and Evaluation of Sputtering Barrier/seed layer In Through Silicon Via for 3-D integration [J], Tsinghua Science and Technology, 2014, 19(2): 150-160. DOI: 10.1109/TST.2014.6787368 [PDF]
Wei, T. W., C. Jian*, et al., Optimization and Evaluation of Sputtering Barrier/seed layer In Through Silicon Via for 3-D integration [J], Tsinghua Science and Technology, 2014, 19(2): 150-160.