Heat and Mass Transfer in Confined Impingement Jets and Microchannels – S-PACK Lab (Semiconductor Packaging Laboratory)

Akshat Patel, Gopinath Sahu, Wei, T.W., Heat Transfer Enhancement for Direct-on-Chip Impingement Jet Cooling using Variable Micro Pin Fins and Tapered Impingement Cavity, Itherm 2024.

Akshat Patel, Gopinath Sahu, Wei, T.W., Heat Transfer Enhancement for Direct-on-Chip Impingement Jet Cooling using Variable Micro Pin Fins and Tapered Impingement Cavity, Itherm 2024. [PDF]

Lyu, Shuhang, Qianying Wu, and Tiwei Wei. “Numerical modelling and analysis of porous surface-enhanced jet cooling using copper inverse opals in single-phase flow.” Flow, 2024, E9.

Lyu, Shuhang, Qianying Wu, and Tiwei Wei. “Numerical modelling and analysis of porous surface-enhanced jet cooling using copper inverse opals in single-phase flow.” Flow, 2024, E9. DOI: https://doi.org/10.1017/flo.2024.6 [PDF]

Lyu, Shuhang, Qianying Wu, and Tiwei Wei. “Hotspot-targeted Cooling Scheme with Hybrid Jet Impingement/Thermal Through Silicon Via (TSV).” 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2023.

Lyu, Shuhang, Qianying Wu, and Tiwei Wei. “Hotspot-targeted Cooling Scheme with Hybrid Jet Impingement/Thermal Through Silicon Via (TSV).” 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2023. DOI:10.1109/ITherm55368.2023.10177590 [PDF]

Lin, Yujui, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, and Kenneth Goodson. “Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module.” Journal of Electronic Packaging (2023): 1-45.

Lin, Yujui*, Tiwei Wei*, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, and Kenneth Goodson. “Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module.” Journal of Electronic Packaging (2023): 1-45.

Oprins H, Wei T, Cherman V, et al. Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD–FEM modeling study[C]//2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2023: 1-10.

H Oprins, Tiwei Wei, Vladimir Cherman, E Beyne (2023, May). Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD–FEM modeling study. In 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1-10). IEEE.

Wei, T. W.*, Hazra, S., Asheghi, M., & Goodson, K. E. Numerical Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3D Manifold Coolers. Journal of Electronic Packaging 2022.

Wei, T. W.*, Hazra, S., Asheghi, M., & Goodson, K. E. Numerical Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3D Manifold Coolers. Journal of Electronic Packaging 2022. DOI: 10.1115/1.4055468 [PDF]

Wei, T. W.*, Oprins, H., et al., Heat Transfer and Friction Factor Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets, Int. J. Heat Mass Transf, 2021, Volume 182, 121865.

Wei, T. W.*, Oprins, H., et al., Heat Transfer and Friction Factor Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets, Int. J. Heat Mass Transf, 2021, Volume 182, 121865. DOI: 10.1016/j.ijheatmasstransfer.2021.121865 [PDF]

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, T., Nozzle Scaling Effects for the Thermohydraulic Performance of Microjet Impingement Cooling with Distributed Returns, Applied Thermal Engineering, Volume 180, 5 November 2020, 115767.

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, T., Nozzle Scaling Effects for the Thermohydraulic Performance of Microjet Impingement Cooling with Distributed Returns, Applied Thermal Engineering, Volume 180, 5 November 2020, 115767. DOI: 10.1016/j.applthermaleng.2020.115767 [PDF]

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels. Fluids, 4(3), 145.

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels. Fluids, 4(3), 145. DOI: 10.3390/fluids4030145 [PDF]