Electronics Cooling and Thermal Management

Hazra, S.*, Wei, T. W., Lin, Y., Asheghi, M, Goodson, K., Gupta M. P., Degner M., Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling, International Journal of Heat and Mass Transfer, 2022, 197, 123356.

Hazra, S.*, Wei, T. W., Lin, Y., Asheghi, M, Goodson, K., Gupta M. P., Degner M., Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling, International Journal of Heat and Mass Transfer, 2022, 197, 123356. [PDF]

Wei, T. W.*, Oprins, H., et al., Experimental and Numerical Study of 3D Printed Direct Jet Impingement Cooling for High Power, Large Die Size Applications, in IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, doi: 10.1109/TCPMT.2020.3045113.

Wei, T. W.*, Oprins, H., et al., Experimental and Numerical Study of 3D Printed Direct Jet Impingement Cooling for High Power, Large Die Size Applications, in IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020. DOI: 10.1109/TCPMT.2020.3045113 [PDF]

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2020). Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5 D integrated systems. Applied Thermal Engineering, 2020, 164, 114535.

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2020). Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5 D integrated systems. Applied Thermal Engineering, 2020, 164, 114535. DOI: 10.1016/j.applthermaleng.2019.114535 [PDF]

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Low-cost Energy Efficient On-chip Hotspot Targeted Microjet Cooling for High Power Electronics. IEEE Transactions on Components, Packaging and Manufacturing Technology. vol. 10, no. 4, pp. 577-589, April 2020.

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Low-cost Energy Efficient On-chip Hotspot Targeted Microjet Cooling for High Power Electronics. IEEE Transactions on Components, Packaging and Manufacturing Technology. vol. 10, no. 4, pp. 577-589, April 2020. DOI: 10.1109/TCPMT.2019.2948522 [PDF]

Wei, T. W.*, Oprins, H., Cherman, V., Van der Plas, G., De Wolf, I., Beyne, E., & Baelmans, M. (2019). Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip. Applied thermal engineering, 152, 308-318.

Wei, T. W.*, Oprins, H., Cherman, V., Van der Plas, G., De Wolf, I., Beyne, E., & Baelmans, M. (2019). Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip. Applied thermal engineering, 152, 308-318. DOI: 10.1016/j.applthermaleng.2019.02.075 [PDF]

Wei, T. W.*, Oprins, H., Cherman, V., Yang, S., De Wolf, I., Beyne, E., & Baelmans, M. (2019). Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(9), 1815-1824.

Wei, T. W.*, Oprins, H., Cherman, V., Yang, S., De Wolf, I., Beyne, E., & Baelmans, M. (2019). Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(9), 1815-1824. DOI: 10.1109/TCPMT.2019.2905610 [PDF]

Wei, T. W.*, Oprins, H., Cherman, V., Qian, J., De Wolf, I., Beyne, E., & Baelmans, M. (2018). High-Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices. IEEE Transactions on Power Electronics, 34(7), 6601-6612.

Wei, T. W.*, Oprins, H., Cherman, V., Qian, J., De Wolf, I., Beyne, E., & Baelmans, M. (2018). High-Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices. IEEE Transactions on Power Electronics, 34(7), 6601-6612. DOI: 10.1109/TPEL.2018.2872904 [PDF]