Wei, T. W.*, Oprins, H., Cherman, V., Yang, S., De Wolf, I., Beyne, E., & Baelmans, M. (2019). Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(9), 1815-1824. DOI: 10.1109/TCPMT.2019.2905610 [PDF]
Wei, T. W.*, Oprins, H., Cherman, V., Yang, S., De Wolf, I., Beyne, E., & Baelmans, M. (2019). Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(9), 1815-1824.