Lyu, S. H., Wu, Q. Y., Wei, T. W.*, “Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling,” 2022 IEEE Symposium on Reliability for Electronics & Photonics Packaging (REPP), 2022. [Video]
Lyu, S. H., Wu, Q. Y., Wei, T. W.*, “Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling,” 2022 IEEE Symposium on Reliability for Electronics & Photonics Packaging (REPP), 2022. [Video]