Lyu, S.H., Thomas B., and Wei, T.W.*, Thermo-Mechanical Reliability Analysis and Raman Spectroscopy Characterization of Sub-micron Through Silicon Vias (TSVs) for Backside Power Delivery in 3D Interconnects, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 834-841. DOI: 10.1109/ECTC51529.2024.00134 [PDF]
Lyu, S.H., Thomas B., and Wei, T.W.*, Thermo-Mechanical Reliability Analysis and Raman Spectroscopy Characterization of Sub-micron Through Silicon Vias (TSVs) for Backside Power Delivery in 3D Interconnects, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 834-841.