H. Chen, Wei, T. W., Y. Chen, X. Li, N. Li, Q. Zhu, S. Hazra, Y. Zhao, M. P. Gupta, M. Asheghi, Y. Lu, K. Goodson, H. A. Mantooth, “Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler” 2022 IEEE Applied Power Electronics Conference and Exposition. [PDF]
H. Chen, Wei, T. W., Y. Chen, X. Li, N. Li, Q. Zhu, S. Hazra, Y. Zhao, M. P. Gupta, M. Asheghi, Y. Lu, K. Goodson, H. A. Mantooth, “Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler” 2022 IEEE Applied Power Electronics Conference and Exposition.