Dr. Wei, Keyu, and Shuhang travelled to the beautiful San Diego city this week for presenting our work at ASME InterPACK2023! Shuhang’s presentation on two-phase impingement cooling with pin-fin surface enhancement together with Qianying from Stanford nanoheat Keyu’s talk on CIO-assisted microbump bonding for advanced packaging
Thank Mr. Jared Pike for taking the nice photos!
We posted a featured blog on the CoE Medium homepage to introduce our lab! Making semiconductors dense and cool | by Purdue College of Engineering | Purdue Engineering Review | Jan, 2023 | Medium
Our lab has 4 SCALE SURF positions for this summer, with topics of advanced packaging and heterogeneous integration. Those projects are from SCALE SURF research projects. SCALE projects are restricted to students who are U.S. Citizens. By applying to this project, you can be considered for any of the SCALE projects with one application. See https://lnkd.in/gfMaX6cT to […]