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Congratulations on Prof. Wei’s Winning Intel 2024 Rising Star Faculty Award!

Check the news out at Purdue ME website: Tiwei Wei receives Intel’s 2024 Rising Star Faculty Award – Mechanical Engineering – Purdue University Tiwei Wei’s research focuses on solving the fabrication challenges and heat transfer issues in advanced semiconductor packaging and assembly. He is developing new materials and techniques for scaling 3D interconnect density, including […]

Presenting Our Work at ASME InterPACK2023!

Dr. Wei, Keyu, and Shuhang travelled to the beautiful San Diego city this week for presenting our work at ASME InterPACK2023! Shuhang’s presentation on two-phase impingement cooling with pin-fin surface enhancement together with Qianying from Stanford nanoheat Keyu’s talk on CIO-assisted microbump bonding for advanced packaging