We are proud to share a historic milestone for our group! Our very first PhD student, Dr. Shuhang Lyu, co-advised with Prof. Thomas Beechem, has successfully passed his final PhD defense. His dissertation, “Understanding Thermomechanical Response of Scaled Through Silicon Vias for High-Density 3D Packaging,” provides important insights into reliability challenges in next-generation microelectronic systems. […]
Anaheim, CA — At the ASME Electronic and Photonic Packaging Division’s InterPACK 2025 conference, Prof. Tiwei Wei received the prestigious EPPD Early Career Engineer Award in recognition of his contributions to electronic and photonic packaging. Prof. Wei expressed gratitude to mentors, collaborators, and students for their continuous support, noting that the honor further motivates his […]
Originial Post: https://engineering.purdue.edu/ME/News/2025/wiretowire-tsvs-may-be-the-key-to-faster-semiconductors As computer processors get smaller and more powerful, semiconductor engineers are running into the physical limits of how fast these chips can operate. One strategy involves stacking chips in 3D and using tiny wires called TSVs (through silicon vias) as vertical connectors. Purdue University researchers are zeroing in on the study of […]
March 18, 2025 – Washington, D.C. – The Honorable Dr. Chris Wright, U.S. Secretary of Energy, made a visit to the Purdue University-led research team during the 2025 ARPA-E Energy Innovation Summit. Dr. Wright experienced a live demonstration of the team’s innovative in-package direct-on-chip two-phase cooling technology, that is aimed at addressing the thermal challenges […]
Check the news out at Purdue ME website: Tiwei Wei receives Intel’s 2024 Rising Star Faculty Award – Mechanical Engineering – Purdue University Tiwei Wei’s research focuses on solving the fabrication challenges and heat transfer issues in advanced semiconductor packaging and assembly. He is developing new materials and techniques for scaling 3D interconnect density, including […]
Dr. Wei, Keyu, and Shuhang travelled to the beautiful San Diego city this week for presenting our work at ASME InterPACK2023! Shuhang’s presentation on two-phase impingement cooling with pin-fin surface enhancement together with Qianying from Stanford nanoheat Keyu’s talk on CIO-assisted microbump bonding for advanced packaging
Thank Mr. Jared Pike for taking the nice photos!
We posted a featured blog on the CoE Medium homepage to introduce our lab! Making semiconductors dense and cool | by Purdue College of Engineering | Purdue Engineering Review | Jan, 2023 | Medium
Our lab has 4 SCALE SURF positions for this summer, with topics of advanced packaging and heterogeneous integration. Those projects are from SCALE SURF research projects. SCALE projects are restricted to students who are U.S. Citizens. By applying to this project, you can be considered for any of the SCALE projects with one application. See https://lnkd.in/gfMaX6cT to […]