Zheng, G., Wu, Q. Y., Wei, T. W.*, “Thermomechanical Modeling and Reliability Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling,” 2022 IEEE Symposium on Reliability for Electronics & Photonics Packaging (REPP), 2022. [Video]
Zheng, G., Wu, Q. Y., Wei, T. W.*, “Thermomechanical Modeling and Reliability Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling,” 2022 IEEE Symposium on Reliability for Electronics & Photonics Packaging (REPP), 2022. [Video]