Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Van der Plas, G., Beyne, E., & Baelmans, M. (2019, May). Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5 D Si Interposer Packages. In 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1243-1252). IEEE. [PDF]
Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Van der Plas, G., Beyne, E., & Baelmans, M. (2019, May). Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5 D Si Interposer Packages. In 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1243-1252). IEEE.