Feifan Xie, Shuhang Lyu, Wei, T.W., Thermal Analysis of Dual-sided Cooling for Backside Power Delivery Networks (BSPDN) on 2.5D Glass/Silicon Interposer Package, Itherm 2024. [PDF]
Feifan Xie, Shuhang Lyu, Wei, T.W., Thermal Analysis of Dual-sided Cooling for Backside Power Delivery Networks (BSPDN) on 2.5D Glass/Silicon Interposer Package, Itherm 2024.