Wei, T. W., Jung, K. W., Piazza, A., Hazra, S., Iyengar, M., Malone, C., Asheghi, M., & Goodson, K. E*. Parametric CFD Study of Large Footprint (24 x 24 mm2) Silicon-based Embedded Microchannel-3D Manifold Coolers. InterPACK 2020. (presentation only)
Wei, T. W., Jung, K. W., Piazza, A., Hazra, S., Iyengar, M., Malone, C., Asheghi, M., & Goodson, K. E*. Parametric CFD Study of Large Footprint (24 x 24 mm2) Silicon-based Embedded Microchannel-3D Manifold Coolers. InterPACK 2020. (presentation only)