Lin, Y., Wei, T., Moy, W. J., Chen, H., Gupta, M. P., Degner, M., … & Goodson, K. (2022). Point-Contact Bonding of Integrated 3D Manifold Microchannel Cooling Within Direct Bonded Copper (DBC) Platform. Journal of Electronic Packaging, 1-20. – S-PACK Lab (Semiconductor Packaging Laboratory)

Lin, Y., Wei, T., Moy, W. J., Chen, H., Gupta, M. P., Degner, M., … & Goodson, K. (2022). Point-Contact Bonding of Integrated 3D Manifold Microchannel Cooling Within Direct Bonded Copper (DBC) Platform. Journal of Electronic Packaging, 1-20.

Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, Kenneth Goodson (2022). Point-Contact Bonding of Integrated 3D Manifold Microchannel Cooling Within Direct Bonded Copper (DBC) Platform. Journal of Electronic Packaging, 1-20.