Chen, H., Lin, Y., Wei, T., Li, X., Paul, R., Whitt, R., … & Mantooth, H. A. (2023, March). Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler. In 2023 IEEE Applied Power Electronics Conference and Exposition (APEC) (pp. 366-371). IEEE. – S-PACK Lab (Semiconductor Packaging Laboratory)

Chen, H., Lin, Y., Wei, T., Li, X., Paul, R., Whitt, R., … & Mantooth, H. A. (2023, March). Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler. In 2023 IEEE Applied Power Electronics Conference and Exposition (APEC) (pp. 366-371). IEEE.

Hao Chen, Yujui Lin, Tiwei Wei, Xiaoling Li, Riya Paul, Reece Whitt, Xiaoqing Song, Yue Zhao, Mehdi Asheghi, H Alan Mantooth (2023, March). Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler. In 2023 IEEE Applied Power Electronics Conference and Exposition (APEC) (pp. 366-371). IEEE.