Yogi, K., Sahu, G., Rajeev, S., Lattupalli, H. K., Wang, K., Chen, Z., … & Wei, T. (2026). Experimental Characterization and Server-Level Demonstration of Confined, Direct-on-Silicon Two-Phase Jet-Impingement Cooling With Additively Manufactured Porous-Wick-Assisted Phase Separation. Journal of Electronic Packaging, 148(2), 020904. https://doi.org/10.1115/1.4071262