Patel, A., Yogi, K., Sahu G., Wei, T., A Novel Multi-chip Jet Impingement Cooler for Direct-on-chip Cooling of High Performance Interposer Package, 3DIC 2024. [PDF]
Patel, A., Yogi, K., Sahu G., Wei, T., A Novel Multi-chip Jet Impingement Cooler for Direct-on-chip Cooling of High Performance Interposer Package, 3DIC 2024.