Patel, A., Yogi, K., Sahu, G., & Wei, T.W.*, (2025). Multi-chip Jet impingement cooling for heat dissipation in 2.5 D integrated system with 1 kW+ thermal design power. International Journal of Heat and Mass Transfer, 244, p.126978. https://doi.org/10.1016/j.ijheatmasstransfer.2025.126978