Patel, A., Yogi, K., Sahu, G., & Wei, T.W.*, (2025). Direct-On-Chip Two-Phase Jet Impingement Cooling of Multichip Packages: Distributed Inlet-Outlet Nozzles. International Journal of Heat and Mass Transfer, Volume 252, 2025, 127514, ISSN 0017-9310. https://doi.org/10.1016/j.ijheatmasstransfer.2025.127514