Anaheim, CA — At the ASME Electronic and Photonic Packaging Division’s InterPACK 2025 conference, Prof. Tiwei Wei received the prestigious EPPD Early Career Engineer Award in recognition of his contributions to electronic and photonic packaging. Prof. Wei expressed gratitude to mentors, collaborators, and students for their continuous support, noting that the honor further motivates his group to advance semiconductor packaging and multiphysics reliability research at UCLA.
In addition, Ye Yang, a second-year PhD student in Prof. Wei’s group, won the 2025 Nasser Grayeli Best Poster Award for his work on high-aspect-ratio copper-filled through-glass vias (TGVs) for advanced 3D integration. The project highlights improved vertical interconnect density and thermomechanical reliability, supporting next-generation heterogeneous integration.
The recognitions underscore Semiconductor Integration & Multiphysics Reliability Laboratory growing impact in semiconductor packaging, reliability, and advanced manufacturing.